Technical Bulletins

Rosin Based ROL1 Paste Flux

Rosin Based Paste Flux

A modified rosin, no-clean solder paste with a long stencil life and high activity for excellent solderability. Designed for applications that require high process tolerance during printing and reflow due varying board types and conditions

A standard flux formulated to meet the J-STD-002 & J-STD-003C specification for use in testing the solderability of component leads. 

A no clean flux designed to provide excellent soldering results (low defects rates), even when the surfaces to be soldered (component leads and pads) are not highly solderable.  Works particularly well with bare copper boards protected with organic or rosin/resin coatings and with tin-lead coated PCB's. Used successfully in both tin-lead and lead-free applications.

No Clean, Cored Solder Wire

Highly Activated Rosin Core Solder Wire

A liquid activitated rosin flux for dip-tinning of component leads, as well as for conventional wave and hand soldering.

A lead-free alloy suitable for use as a replacement for Sn63 alloy in the wave solder process.