Technical Bulletins

A blend of solvents designed to be used in printing equipment with an on-board stencil wipe.  This product is formulated to efficiently remove solder paste and SMD adhesives from the bottom-side of stencils to help ensure defect-free printing.

A cleaner for Stencils and Misprints with an aggressive solvent developed to replace isopropanol (IPA) in various manual and equipment-related cleaning applications.

A screen cleaning liquid designed for use at full strength and formulated for efficient removal of solder paste residues from printing stencils.  Does not contain CFC’s or other ozone depleting materials.

A screen cleaning liquid designed for use at full strength and formulated for efficient removal of solder paste residues from printing stencils.  It does not contain CFCs or other ozone depleting materials

A no-clean flux developed to meet the industry’s need for high-speed automation and high reliability, while reducing cost and potential environmental impact.

A no-clean flux developed to meet the industry’s need for high speed automation and high reliability while reducing cost and potential environmental impact.

This flux provides the broadest process window for a rosin/resin-free, no-clean flux, leaves no visible residue to interfere with pin testing, and is designed to provide excellent soldering results (low defects rates) to tin-lead coated PCB’s and to bare copper with organic coatings.