Technical Bulletins

Specifically developed to eliminate the tendency for solder balling and solder bridging-two defects which are normally associated with the use of the chip wave. Exhibits the lowest tendency for solder ball generation over a wide variety of solder masks.  

An active, low solids, no-clean flux. It was specifically developed to eliminate the tendency for solder balling and solder bridging-two defects which are normally associated with the use of the chip wave

An active, low solid, no-clean flux formulated with a proprietary mixture of organic activators designed to reduce the surface tension between the solder resist and the solder, thereby dramatically reducing the tendency of solder ball generation and also designed to be more thermally stable, thereby reducing the occurrence of solder bridging.

A mixture of organic solvents designed especially for non-aqueous cleaning applications.  Effectively removes most types of raw solder paste residues and uncured SMT adhesives.  Also effective on post-soldering flux residues and other organic contaminants associated with printed circuit board assembly

A mixture of organic solvents designed especially for non-aqueous cleaning applications.  Effectively removes most types of raw solder paste residues uncured SMT adhesives and polymer solder pastes from stencils and misprinted assemblies. Also effective on post-soldering flux residues and other organic contaminants associated with printed circuit board assembly. 

A halide-free, halogen-free, rosin formulation combining high soldering efficiency and low solids content with insulating, non-corrosive, post-soldering residues.

A non-corrosive resin formulation that pass both the Copper Mirror and Silver Chromate Paper Tests yet are highly effective fluxes. Especially designed for foam fluxing but can also be applied from a wave.

Designed for the removal of non-reflowed flux, solder paste and uncured adhesives from stencils and misprinted boards. Has proven compatible with most standard aqueous stencil cleaning equipment.

A low ionic halide activated, pure rosin flux designed for defect free wave soldering of conventional printed through hole and surface mount technology assemblies.

A very efficient halide-free and rosin/resin free, low solids, no-clean flux.