ALPHA® HiTech® CU21-3240 Underfill
One-component capillary underfill with high Tg and low CTE for reliable protection of assembled chip packages on PCBs.
Contact UsProduct Overview
ALPHA HiTech CU21-3240 is a one-component capillary underfill designed to protect assembled chip packages on printed circuit boards.
It features a high Glass Transition Temperature (Tg) and low Coefficient of Thermal Expansion (CTE), providing a high-reliability solution.
Product Features
Full Component Coverage
Provides full component coverage when dispensed onto a substrate preheated to 70–100°C.
Stringent Thermal Cycling Test Condition
High Tg and low CTE values drastically improve the ability to pass more stringent thermal cycling test conditions.
Excellent Thermal Cycling Test performance
Halogen-Free
Complies with RoHS Directive 2015/863/EU
Underfill for Exceptional Thermal Fatigue Resistance
Standalone Tin-Silver-Copper (SAC) solder joints in Ball Grid Array (BGA) and Chip Scale Packaging (CSP) assemblies can falter in thermally harsh automotive applications. A high Tg and low CTE underfill (UF) serves as a reinforcement solution. Since rework is not required, higher filler content can be used in the formulation to enhance these attributes.
ALPHA HiTech CU21-3240 features a high Tg of 165°C and low CTE1/CTE2 values of 31 ppm/105 ppm on assembled CVBGA360. It has been tested to pass 5000 cycles of -40 +125°C thermal cycling tests. To achieve a better flow rate, preheat the substrates during dispensing.
