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Product Overview
ALPHA HiTech CU31-2030's low viscosity characteristic enables fast and efficient flow properties at room temperature. Its high Tg and low modulus properties enables excellent reliability performance.
ALPHA HiTech CU31-2030 is suitable for assembling BGA, CSP and Flip Chip devices. All ALPHA HiTech products are halogen-free.
Product Features
- Low Viscosity
- Room temperature flow capability
- High Glass Transition Temperature (Tg)
- Low Modulus
- Reworkable
- Excellent reliability performance
- Halogen-free and complies with RoHS Directive 2015/863/EU
ALPHA HiTech CU31-2030 is excellent for portable electronics
ALPHA HiTech CU31-2030's low viscosity value of only 200 – 1000 cps allows it to fast flow beneath the component at 25.4°C, (see Table 1 below), enabling it to meet high throughput manufacturing requirements. It also meets recent industry requirements for a higher Tg value, at least above 125°C of Thermal Cycling Test -40 +125°C [TCT]. ALPHA HiTech CU31-2030's Tg is 165°C and has been tested to pass 3000 TCT cycles on CVBGA360. No reinforcement gave only 600 cycles pass.
At the right, Figure 1 illustrates the balance among attributes for this product. Figure 2 shows its reworkable characteristics.
Flow Rate Performance
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