Product Overview

ALPHA HiTech AD43-9600W typically has excellent adhesion performance even after temperature and thermal shock exposure, fast curing performance at low temperatures to provide high throughput manufacturing process, and exhibits high tensile strength during high temperature testing. 

 

 

 

 

Product Features

  • Excellent Adhesion on FR4 and PMMA lens
  • White appearance to avoid ‘flaring’ phenomena when LED is lighted up
  • Halogen-free
  • Complies with RoHS Directive 2015/863/EU
Technical Bulletins
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ALPHA HiTech AD43-9600W Adhesive Technical Bulletin English

Documentation icon - Technical Bulletin

ALPHA HiTech AD43-9600W 粘合剂 技术公告 简体中文

Brochures
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ALPHA HiTech Brochure English

Documentation icon - Brochure

ALPHA HiTech 宣传册 简体中文

ALPHA HiTech AD43-9600W Diagram

High Temperature Resistance Adhesive

During operation, temperature will increase in Back Light Unit (BLU) display.  

To ensure no dislodge or drop-off of parts at this temperature, ALPHA HiTech AD43-9600W has been designed to still provide the enough  adhesion strength to hold these parts.  

It has excellent adhesion on PMMA FR4 and Metal Surfaces.

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

ALPHA HiTech AD13-9692B Adhesive ALPHA® HiTech AD13-9521B ALPHA HiTech SM42-120P Adhesive ALPHA HiTech AD13-9620B Adhesive ALPHA HiTech SM42-1311 Adhesive ALPHA HiTech UP44-5566T Adhesive

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

ALPHA HiTech AD13-9692B Adhesive ALPHA® HiTech AD13-9521B ALPHA HiTech SM42-120P Adhesive ALPHA HiTech AD13-9620B Adhesive ALPHA HiTech SM42-1311 Adhesive ALPHA HiTech UP44-5566T Adhesive

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Gluing, Underfilling and Edgebonding Gluing SMT Components Module Assembly - Tabbing and Stringing Module Assembly - Multibusbar

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Gluing, Underfilling and Edgebonding Gluing SMT Components Module Assembly - Tabbing and Stringing Module Assembly - Multibusbar

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Low Temperature Adhesives High Reliability Adhesives Fine Feature Enabling Adhesives Halogen Free & Zero Halogen Products

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Low Temperature Adhesives High Reliability Adhesives Fine Feature Enabling Adhesives Halogen Free & Zero Halogen Products

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

ALPHA HiTech AD13-9692B Adhesive ALPHA® HiTech AD13-9521B ALPHA HiTech SM42-120P Adhesive ALPHA HiTech AD13-9620B Adhesive ALPHA HiTech SM42-1311 Adhesive ALPHA HiTech UP44-5566T Adhesive

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

ALPHA HiTech AD13-9692B Adhesive ALPHA® HiTech AD13-9521B ALPHA HiTech SM42-120P Adhesive ALPHA HiTech AD13-9620B Adhesive ALPHA HiTech SM42-1311 Adhesive ALPHA HiTech UP44-5566T Adhesive

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Gluing, Underfilling and Edgebonding Gluing SMT Components Module Assembly - Tabbing and Stringing Module Assembly - Multibusbar

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Gluing, Underfilling and Edgebonding Gluing SMT Components Module Assembly - Tabbing and Stringing Module Assembly - Multibusbar

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Low Temperature Adhesives High Reliability Adhesives Fine Feature Enabling Adhesives Halogen Free & Zero Halogen Products

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Low Temperature Adhesives High Reliability Adhesives Fine Feature Enabling Adhesives Halogen Free & Zero Halogen Products
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