Product Overview

ALPHA HiTech AD13-9521B is specially designed for use in camera modules.

This product has good adhesion to a wide range of plastic and metal surfaces used in the camera module assembly, including Nylon (PA9T) and Liquid Crystal Polymer (LCP).

Product Features

  • Low Viscosity
  • Excellent Penetration /Fast Flow
  • Halogen-free and complies with RoHS Directive 2015/863/EU
Technical Bulletins
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ALPHA HiTech AD13-9620B Underfill Technical Bulletin English

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ALPHA HiTech AD13-9620B 底部填充剂 技术公告 简体中文

Brochures
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ALPHA HiTech Brochure English

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ALPHA HiTech 宣传册 简体中文

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Alpha HiTech AD13-9521B Diagram

Higher Spread, Low Curing Temperature Adhesive

ALPHA HiTech AD13-9521B is suitable for application requiring higher spreading properties.

Deposition into gaps or hidden surfaces requires such property.

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

ALPHA HiTech AD13-9692B Adhesive ALPHA HiTech SM42-120P Adhesive ALPHA HiTech AD13-9620B Adhesive ALPHA HiTech AD43-9600W Adhesive ALPHA HiTech SM42-1311 Adhesive ALPHA HiTech UP44-5566T Adhesive

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

ALPHA HiTech AD13-9692B Adhesive ALPHA HiTech SM42-120P Adhesive ALPHA HiTech AD13-9620B Adhesive ALPHA HiTech AD43-9600W Adhesive ALPHA HiTech SM42-1311 Adhesive ALPHA HiTech UP44-5566T Adhesive

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Module Assembly - Tabbing and Stringing Module Assembly - Multibusbar Gluing, Underfilling and Edgebonding Gluing SMT components

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Module Assembly - Tabbing and Stringing Module Assembly - Multibusbar Gluing, Underfilling and Edgebonding Gluing SMT components

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Fine feature enabling Adhesives Low Temperature Adhesives High Reliability Adhesives Halogen Free & Zero Halogen Products

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Fine feature enabling Adhesives Low Temperature Adhesives High Reliability Adhesives Halogen Free & Zero Halogen Products

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

ALPHA HiTech AD13-9692B Adhesive ALPHA HiTech SM42-120P Adhesive ALPHA HiTech AD13-9620B Adhesive ALPHA HiTech AD43-9600W Adhesive ALPHA HiTech SM42-1311 Adhesive ALPHA HiTech UP44-5566T Adhesive

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

ALPHA HiTech AD13-9692B Adhesive ALPHA HiTech SM42-120P Adhesive ALPHA HiTech AD13-9620B Adhesive ALPHA HiTech AD43-9600W Adhesive ALPHA HiTech SM42-1311 Adhesive ALPHA HiTech UP44-5566T Adhesive

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Module Assembly - Tabbing and Stringing Module Assembly - Multibusbar Gluing, Underfilling and Edgebonding Gluing SMT components

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Module Assembly - Tabbing and Stringing Module Assembly - Multibusbar Gluing, Underfilling and Edgebonding Gluing SMT components

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Fine feature enabling Adhesives Low Temperature Adhesives High Reliability Adhesives Halogen Free & Zero Halogen Products

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Fine feature enabling Adhesives Low Temperature Adhesives High Reliability Adhesives Halogen Free & Zero Halogen Products
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