Excellent Soldering Yield on Various Finishes
Semiconductor Solutions no clean and water soluble paste flux delivers robust and high yield for solder ball attach, flip chip and other soldering applications.
![Solder-Flux-Macdermid-Alpha](/sites/default/files/2021-09/SS_listing-flux1.jpg)
![Solder-flux-macdermid-alpha](/sites/default/files/2021-09/SS_listing-flux3.jpg)
Robust Application for Various Package Designs
ALPHA Paste Flux is the leading choice of solder flux for wafer level CSP, Flip chip and BGA/ CSP ball attach applications.
- Excellent activity allows for excellent soldering to ENIG and Cu OSP soldering process.
- Superior wetting maximizing assembly yields to provide highest ball attach and flip chip yield rates.
- Excellent material stability whereas the flux maintains tack and viscosity over multiple print cycles.
- Excellent cleanability performance in that residues are easily cleaned with DI water.
View Products in Solder Flux
- ALPHA® OA1303
Water soluble liquid flux for wafer level electroplated bump reform.
- Excellent activity allows for superior wetting, maximizing wetting and bump reforming
- Best adapted to bump forming process of lead free SAC alloys
- Excellent cleanability; residues are easily cleaned with DI water
- Suitable for various wafer sizes up to 300mm
- ALPHA® WS9160-M7
Water soluble paste flux for wafer level ball attach on both Fan-in and Fan-out applications.
- Excellent activity allows for excellent soldering to Cu UBM, Cu OSP and ENIG soldering process
- Excellent wettability: Excellent activity reduces the occurrence of dark balls
- Excellent cleanability: Flux residues are removed easily with warm DI water
- High tackiness allows high yields for wafer level ball attach
- ALPHA® NCX-390
No clean paste flux with high activity for a wide range of soldering applications.
- Good thermal stability, tack strength and high activity for excellent yield rates
- IPC-J-STD-004 compliant for long term electrical reliability
- Halide and halogen-free formulation