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Excellent Soldering Yield on Various Finishes
Semiconductor Solutions no clean and water soluble paste flux delivers robust and high yield for solder ball attach, flip chip and other soldering applications.
Robust Application for Various Package Designs
ALPHA Paste Flux is the leading choice of solder flux for wafer level CSP, Flip chip and BGA/ CSP ball attach applications.
- Excellent activity allows for excellent soldering to ENIG and Cu OSP soldering process.
- Superior wetting maximizing assembly yields to provide highest ball attach and flip chip yield rates.
- Excellent material stability whereas the flux maintains tack and viscosity over multiple print cycles.
- Excellent cleanability performance in that residues are easily cleaned with DI water.
View Products in Solder Flux
- ALPHA® OA1303
Water soluble liquid flux for wafer level electroplated bump reform.
- Excellent activity allows for superior wetting, maximizing wetting and bump reforming
- Best adapted to bump forming process of lead free SAC alloys
- Excellent cleanability; residues are easily cleaned with DI water
- Suitable for various wafer sizes up to 300mm
- ALPHA® WS9160-M7
Water soluble paste flux for wafer level ball attach on both Fan-in and Fan-out applications.
- Excellent activity allows for excellent soldering to Cu UBM, Cu OSP and ENIG soldering process
- Excellent wettability: Excellent activity reduces the occurrence of dark balls
- Excellent cleanability: Flux residues are removed easily with warm DI water
- High tackiness allows high yields for wafer level ball attach
- ALPHA® NCX-390
No clean paste flux with high activity for a wide range of soldering applications.
- Good thermal stability, tack strength and high activity for excellent yield rates
- IPC-J-STD-004 compliant for long term electrical reliability
- Halide and halogen-free formulation
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