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Product Overview
ALPHA Argomax 2040 is a silver sintering die attach paste specifically designed for die placement on wet paste (before drying) followed by low-pressure sintering.
Product Features
- Applications: Die Attach, Die Top Attach
- Formulated for printing or dot dispense on Ag/Au surfaces
- Designed for die placement on wet paste
- Pure Silver bond line for high performance and reliability
- High thermal and electrical conductivity
- Low sintering pressure for high yield manufacturing
- Proven long stencil life
ALPHA Argomax Power Electronics Brochure English
ALPHA Argomax功率电子 宣传册 简体中文
Proven reliability in EV drivetrain applications
ALPHA Argomax 2040 Paste is a silver sintering die attach material specifically designed for die placement on wet paste (before drying) followed by low-pressure sintering.
After sintering, it forms a high thermal and electrically conductive pure silver bond between the die and substrate.
This high quality bond enables increased reliability (product life) and higher performance (higher power density).
Related Products
| Product Type | Product Name | Compatible Surface Finish | Product Application Method | End Application |
|---|---|---|---|---|
| Sinter Paste | ALPHA Argomax 2010C Paste | Ag, Au | Die Attach, Die Top Attach | |
| Sinter Paste | ALPHA Argomax 5022 Paste | Cu | Die Attach, Die Top Attach | |
| Sinter Film | ALPHA Argomax 8020 Film | Ag, Au | Die Transfer Film | Die Attach, Die Top Attach |
| Engineered Sinter Product | ALPHA Argomax 6500 Bond Pad | Ag, Au, Cu | Pick & Place | Die Top Attach |
| Engineered Sinter Product | ALPHdA Argomax 9200 Preform | Ag, Au | Pick & Place | Die Top Attach, Package/Module Attach, Substrate Attach, Spacer Attach |
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