Product Overview

MICROFAB MP-2500 is a high-speed copper plating process engineered for mega pillar applications. It provides exceptional within-die (WID) and within-feature (WIF, TIR) uniformity.

Plating copper

220um tall dense Feature – TIR = 0 um		    

Plating-copper

220um tall ISO Feature – TIR = 0 um

Features

  • High speed
  • High purity
  • Flat bump shape
  • Thermal pillar
  • Excellent coplanarity

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MICROFAB MP-2500

Product Name

Cu Packaging Solution

Cu Process Feature

Feature-Property Benefit

MICROFAB MP-2500

Thermal Pillar

Excellent Coplanarity
High Speed
High Purity

Flat Bump Shape
High Throughput
Low KV Capable

Key Packaging Materials

  • Pillar/Post, RDL,
  • Thermal pillar
MICROFAB RDLV 50 MICROFAB RDLV 60 MICROFAB RDLV 70 MICROFAB SPM 1100

Key Packaging Materials

  • Pillar/Post, RDL,
  • Thermal pillar
MICROFAB RDLV 50 MICROFAB RDLV 60 MICROFAB RDLV 70 MICROFAB SPM 1100

2.5D and 3D Wafer Level Packaging

Smaller form factor and integration technologies are driving the need for highly co-planar and flat features so that high reliability and high yield can be realized.

System in Package (SiP) Heterogeneous Integration (2.5/3D) Wafer Level Packaging

2.5D and 3D Wafer Level Packaging

Smaller form factor and integration technologies are driving the need for highly co-planar and flat features so that high reliability and high yield can be realized.

System in Package (SiP) Heterogeneous Integration (2.5/3D) Wafer Level Packaging

Key Solutions for MICROFAB MP-2500

Able to achieve high plating rates while being co-planar, MICROFAB MP-2500 is a solution to interconnect 3D PoP and other through-resist features that terminate at the RDL.

Thermal Management TSV RDL

Key Solutions for MICROFAB MP-2500

Able to achieve high plating rates while being co-planar, MICROFAB MP-2500 is a solution to interconnect 3D PoP and other through-resist features that terminate at the RDL.

Thermal Management TSV RDL

Key Packaging Materials

  • Pillar/Post, RDL,
  • Thermal pillar
MICROFAB RDLV 50 MICROFAB RDLV 60 MICROFAB RDLV 70 MICROFAB SPM 1100

Key Packaging Materials

  • Pillar/Post, RDL,
  • Thermal pillar
MICROFAB RDLV 50 MICROFAB RDLV 60 MICROFAB RDLV 70 MICROFAB SPM 1100

2.5D and 3D Wafer Level Packaging

Smaller form factor and integration technologies are driving the need for highly co-planar and flat features so that high reliability and high yield can be realized.

System in Package (SiP) Heterogeneous Integration (2.5/3D) Wafer Level Packaging

2.5D and 3D Wafer Level Packaging

Smaller form factor and integration technologies are driving the need for highly co-planar and flat features so that high reliability and high yield can be realized.

System in Package (SiP) Heterogeneous Integration (2.5/3D) Wafer Level Packaging

Key Solutions for MICROFAB MP-2500

Able to achieve high plating rates while being co-planar, MICROFAB MP-2500 is a solution to interconnect 3D PoP and other through-resist features that terminate at the RDL.

Thermal Management TSV RDL

Key Solutions for MICROFAB MP-2500

Able to achieve high plating rates while being co-planar, MICROFAB MP-2500 is a solution to interconnect 3D PoP and other through-resist features that terminate at the RDL.

Thermal Management TSV RDL
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