Product Overview

The MICROFAB SC-40 process is engineered as high-speed, low stress solution capable of flat bump shape. It provides good within-wafer, within-die, and within-feature uniformity in a two-part organic package. MICROFAB SC-40 shares family lineage with MICROFAB SC with the added feature of higher plating rates.

Features

  • High speed
  • Good coplanarity
  • Versatility
  • Ease-of-use
  • High throughput

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MICROFAB SC-40 Process

MICROFAB SC-40 process is engineered for high-speed pillar, copper stud and UBM applications. It provides good within-wafer, within-die, and within-feature uniformity in a 2-part organic package that produces dished to dome bump shape.

Plating Precious Copper-Macdermid Alpha

MICROFAB SC-40

Product Name

Cu Packaging Solution

Cu Process Feature

Feature-Property Benefit

MICROFAB SC-40

Pillar/Post
RDL

Good Coplanarity
High Speed
Versatility

Ease-of-Use
High Throughput

Key Barrier Materials and Solders to Produce High Reliability Interconnects

  • Pillar/Post, RDL
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302

Key Barrier Materials and Solders to Produce High Reliability Interconnects

  • Pillar/Post, RDL
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302

Historical POR used on Flipchip Pillars and RDL patterns

Original formulation of MICROFAB SC is the foundation for higher speed versions; SC-32 and re-formulated SC-40 and SC-50

Wafer Level Packaging System in Package (SiP) Heterogeneous Integration

Historical POR used on Flipchip Pillars and RDL patterns

Original formulation of MICROFAB SC is the foundation for higher speed versions; SC-32 and re-formulated SC-40 and SC-50

Wafer Level Packaging System in Package (SiP) Heterogeneous Integration

Historical POR Wafer Bumping

Historical POR for WLP pillar, UBM and RDL features. Two-part additive system for ease of use.

UBM Backside Metal Wafer Bumping RDL Pillar / Post

Historical POR Wafer Bumping

Historical POR for WLP pillar, UBM and RDL features. Two-part additive system for ease of use.

UBM Backside Metal Wafer Bumping RDL Pillar / Post

Key Barrier Materials and Solders to Produce High Reliability Interconnects

  • Pillar/Post, RDL
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302

Key Barrier Materials and Solders to Produce High Reliability Interconnects

  • Pillar/Post, RDL
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302

Historical POR used on Flipchip Pillars and RDL patterns

Original formulation of MICROFAB SC is the foundation for higher speed versions; SC-32 and re-formulated SC-40 and SC-50

Wafer Level Packaging System in Package (SiP) Heterogeneous Integration

Historical POR used on Flipchip Pillars and RDL patterns

Original formulation of MICROFAB SC is the foundation for higher speed versions; SC-32 and re-formulated SC-40 and SC-50

Wafer Level Packaging System in Package (SiP) Heterogeneous Integration

Historical POR Wafer Bumping

Historical POR for WLP pillar, UBM and RDL features. Two-part additive system for ease of use.

UBM Backside Metal Wafer Bumping RDL Pillar / Post

Historical POR Wafer Bumping

Historical POR for WLP pillar, UBM and RDL features. Two-part additive system for ease of use.

UBM Backside Metal Wafer Bumping RDL Pillar / Post
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