Product Overview

The MICROFAB SC-50 process is engineered as a high-speed, low stress solution capable of flat bump shape. It provides good within-wafer, within-die, and within-feature uniformity in a two-part organic package. MICROFAB SC-50 shares family lineage with MICROFAB SC with the added feature of higher plating rates.

Features

  • High speed
  • Good coplanarity
  • Versatility
  • Ease-of-use
  • High throughput

For consultation with one of our experts and access to detailed technical data , please fill out and submit the contact us form.

MICROFAB SC-50 Process

The MICROFAB SC-50 process is engineered for high-speed pillar, copper stud and UBM applications. It provides good within-wafer, within-die, and within-feature uniformity in a 2-part organic package that produces dished to dome bump shape.

Plating Copper-Macdermid Alpha

MICROFAB SC-50

Product Name

Cu Packaging Solution

Cu Process Feature

Feature-Property Benefit

MICROFAB SC-50

Pillar/Post
RDL

Good Coplanarity
High Speed
Versatility

Ease-of-Use
High Throughput

Key Barrier Materials and Solders to Produce High Reliability Interconnects

  • Pillar/Post, RDL
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302

Key Barrier Materials and Solders to Produce High Reliability Interconnects

  • Pillar/Post, RDL
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302

Higher Plating Rates than Traditional MICROFAB SC

Re-formulated for advanced environmental and regulatory compliance.

Wafer Level Packaging System in Package (SiP) Heterogeneous Integration Sensors

Higher Plating Rates than Traditional MICROFAB SC

Re-formulated for advanced environmental and regulatory compliance.

Wafer Level Packaging System in Package (SiP) Heterogeneous Integration Sensors

Ideal for Microbump, Pillars and RDL Structures

Historical POR for WLP pillar, UBM and RDL features. Two-part additive system for ease of use.

UBM Backside Metal Wafer Bumping RDL Pillar / Post

Ideal for Microbump, Pillars and RDL Structures

Historical POR for WLP pillar, UBM and RDL features. Two-part additive system for ease of use.

UBM Backside Metal Wafer Bumping RDL Pillar / Post

Key Barrier Materials and Solders to Produce High Reliability Interconnects

  • Pillar/Post, RDL
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302

Key Barrier Materials and Solders to Produce High Reliability Interconnects

  • Pillar/Post, RDL
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302

Higher Plating Rates than Traditional MICROFAB SC

Re-formulated for advanced environmental and regulatory compliance.

Wafer Level Packaging System in Package (SiP) Heterogeneous Integration Sensors

Higher Plating Rates than Traditional MICROFAB SC

Re-formulated for advanced environmental and regulatory compliance.

Wafer Level Packaging System in Package (SiP) Heterogeneous Integration Sensors

Ideal for Microbump, Pillars and RDL Structures

Historical POR for WLP pillar, UBM and RDL features. Two-part additive system for ease of use.

UBM Backside Metal Wafer Bumping RDL Pillar / Post

Ideal for Microbump, Pillars and RDL Structures

Historical POR for WLP pillar, UBM and RDL features. Two-part additive system for ease of use.

UBM Backside Metal Wafer Bumping RDL Pillar / Post
What do you need solved?
Let our experts find your solution.
Contact Us