Technical Bulletins

一种无铅免清洗锡膏，专为喷射印刷机而设，其流变学符合标准点胶或喷涂要求。

A tin-lead, eutectic solder paste for jet printing.

A highly active, halide-free, water soluble organic flux especially designed to give excellent solder wetting with Kovar, Alloy 42, Nickel, and Copper surfaces.

A no-clean flux with transparent, non-tacky residue. It can be used for a wide range of applications such as through-hole soldering and ball grid array (BGA) assemblies.

一款免清洗助焊膏，具有透明，非粘性残留物。

A modified weight rosin, no-clean solder cream designed for surface mount processes and other demanding electronics assembly applications where post reflow cleaning is not required.

No-clean, rosin-based paste flux designed for surface mount, flip chip, BGA processes.

No-Clean flux designed to deliver outstanding board cosmetics

Was specifically developed to deliver outstanding board cosmetics and to eliminate the tendency for solder balling and solder bridging, two types of defects which are normally associated with the use of the chip wave.