Technical Bulletins

A lead-free, no-clean, pin testable paste flux designed for a broad range of applications.

A lead-free, no-clean solder paste designed for a broad range of applications. Yields excellent print capability performance across various board designs,particularly with ultra-fine feature repeatability (11 mil squares) and high “through-put” applications.

一款无铅免清洗可针测助焊膏，适用于大部份焊接应用。

A lead-free, zero-halogen no-clean solder paste designed for applications where residue with excellent pin testing property and ability to pass JIS Copper Corrosion test are required. Also designed to enable consistent fine pitch printing capability, down to 180mm circle printed with 100mm thickness stencil. 

A no-clean paste flux designed for a broad range of applications, including rework of components, and is formulated to deliver excellent visual joint cosmetics and clear, colorless flux residues.

A lead-free, no-clean solder paste designed for fine feature lead free SMT processing.

A lead-free, zero-halogen, NWO (Non-Wet Open) resistant, no-clean solder paste designed for minimizing BGA non-wet and head in pillow defects.

一款无铅免清洗锡膏，旨在用于广泛应用。在各种电路板设计中均能发挥出色的印刷性能，特别是在超精细特征重复性（11 mil squares）和高“吞吐量”应用中。