Technical Bulletins

>A lead free, zero-halogen, no-clean solder paste designed to provide consistent printing capability, good solder ball performance and prolong tack strength at varying environmental exposure condition.

无铅，完全不含卤素，免清洗的锡膏。

A lead-free, no-clean solder paste designed for a broad range of applications. 

无铅，免清洗的锡膏，适合用于各种应用场合。

A lead-free, no-clean solder paste designed to maximize SMT line throughput and yields.  This paste yields excellent fine pitch and high-speed printing properties and maximize cosmetic* and functional reflow results. Also available in a dispensing grade for dispense and rework applications

A solder paste whose flux system has been designed for fine pitch, lead-free applications, is a no-clean, REL0 formulation designed to offer the SMT process stable viscosity and thixotropy with continuous printing, and has also been formulated to provide resistance to high temperature pre-heating, wettability on ultra-fine pitch pads and reduce the occurrence of solder balling defects.

一款无铅免清洗的锡膏，专为精密特性印刷和回流焊而设计。

This no-clean flux is engineered to be used in the placement and reflow of lead-free solders for BGA attach processes.  Before reflow,the flux provides sufficient tack to hold the BGA in place.  After reflow the residue is clear, colorless. This paste flux can also be used in the rework of components.

A lead-free, no-clean solder paste designed for a broad range of applications which yields excellent print capability performance across various board designs and, particularly, with ultra-fine feature repeatability (11 mil Squares) and high throughput applications.

A lead-free, zero-halogen no-clean solder paste designed for applications where residue with excellent pin testing property and ability to pass JIS Copper Corrosion test are required and  is also designed to enable consistent fine pitch printing capability.

An Ultra-Fine Featured, Zero Halogen, Lead-Free Solder Paste

无铅，完全不含卤素，免清洗的锡膏。