Technical Bulletins

一种应用广泛的、无铅、免清洗锡膏。

A Pb-free, zero-halogen no-clean solder paste engineered to enable consistent fine pitch printing capability and designed for applications where ultra-low voiding performance, excellent ICT pin testing first pass yield, and the ability to pass JIS Copper Corrosion test are required.

No-clean, zero-halogen, lead-free paste flux.

一款免清洗助焊膏，可用于 BGA 焊接工艺中无铅焊料贴装和回流。

一种可使用5 号粉（15 至 25 μm）并具备低银特性的 SAC305 锡膏，旨在满足超精细特征应用的细分市场。

No-clean, Zero-Halogen, lead free paste flux