Technical Bulletins

A lead-free, zero-halogen no-clean solder paste suitable for applications where high electrical reliability is required.

A zero-halogen, lead-free solder paste designed and suitable for SMT and Die Attach processes and can be applied by dispensing or stencil printing.

An active, no-clean flux. It is formulated with a proprietary mixture of organic activators and designed to be more thermally stable, thereby, increasing soldering performance for PoP top and bottom package attach and fine pitch flip chip applications.

No clean flux designed for stencil printing application in a surface mount process or rework applications in a surface mount process.

Solder Paste for Fine Pitch Stencil Printing.

一款表面贴装应用的网板印刷锡膏。

A lead-free, zero-halogen no-clean solder paste designed for applications where residue with excellent pin testing property and ability to pass JIS Copper Corrosion test are required.

Lead-Free Solder Paste for Fine-Pitch Printing.

ALPHA OL233HF 는 높은 전기적 신뢰성이 요구되는 애플리케이션에 적합한 무연, 무 할로겐, 무 세정 솔더 페이스트이다.

는 높은 전기적 신뢰성이 요구되는 애플리케이션에 적합한 무연, 무 할로겐, 무 세정 솔더 페이스트이다.

An ultra-low temperature solder paste paired with Alpha’s ULT1 alloy intended for soldering temperature sensitive components and substrates. This innovative chemistry enables peak reflow temperatures below 150 °C, making it ideal for soldering of heat sensitive components and sub-assemblies.

一款新型超低温锡膏。