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- Argomax® AccuLam™ 8022
Breakthrough Technology Launching For The Electric Vehicle Market
- Prescored film allows for a precise attachment to the designated sinter surface
- Patterned film format to match process size requirements providing a reliable and consistent lamination process
- High thermal and electrical conductivity
- Pure silver bond line, for high reliability and performance
- No printing and drying equipment necessary: less capital and cleanroom investment cost
- ALPHA® Argomax® 8035 Film
Sinter Silver Film for Die Attachment – Wafer Level Processing with Copper surface Die attach
- Designed specifically for wafer dicing after lamination with dicing tape
- Formulated for Cu surface die attach
- Film can be cut to custom sizes
- Pure silver bond line for high performance and reliability
- High thermal and electrical conductivity
- Low sintering pressure for high yield manufacturing
- Die attach temperatures suitable for semiconductor manufacturing
- ALPHA® Argomax® 8031 Film
Sinter Silver Film for Die Attachment – Wafer Level Processing
- Designed specifically for wafer dicing after lamination with dicing tape
- Formulated for Ag/Au surface die attach
- Film can be cut to custom sizes
- Pure silver bond line for high performance and reliability
- High thermal and electrical conductivity
- Low sintering pressure for high yield manufacturing
- Die attach temperatures suitable for semiconductor manufacturing
- ALPHA® Argomax® 8021 Film
Sinter Silver Film for Die Attachment
- Die Transfer Film (DTF) process
- Optimized for a wide range of surfaces
- Customized for fast and easy die and clip lamination
- Pure silver bond line for high performance and reliability
- High thermal and electrical conductivity
- Low sintering pressure for high yield manufacturing
- Die attach temperatures suitable for semiconductor manufacturing
- ALPHA® Argomax® 8020 Film
Sinter Silver Film for Die Attachment
- Die-Transfer-Film (DTF) process
- Designed for Ag/Au surfaces
- Customized for fast and easy die and spacer lamination
- Pure silver bond line for high performance and reliability
- High thermal and electrical conductivity
- Low sintering pressure for high yield manufacturing
- Die attach temperatures suitable for semiconductor manufacturing
- ALPHA® Argomax® 8010 Film
Sinter Silver Film for Large Area Lamination
- Large area lamination film solution
- Custom cut film sizes available
- Pure Silver bond line for high performance and reliability
- High thermal and electrical conductivity
- Low sintering pressure for high yield manufacturing
- ALPHA® Argomax® 5040 Paste
Sinter Silver Paste for Die Attachment on Copper surface with Wet Die Placement
- Application: Die Attach, Die Top Attach
- Formulated for printing or dot dispense on Cu surfaces
- Designed for die placement on wet paste
- Pure Silver bond line for high performance and reliability
- High thermal and electrical conductivity
- Low sintering pressure for high yield manufacturing
- ALPHA® Argomax® 5022 Paste
Sinter Silver Paste for Die Attachment on Copper Surface
- Application: Die Attach, Die Top Attach
- Formulated for printing on Cu surfaces
- Designed for die placement on dried paste
- Pure Silver bond line for high performance and reliability
- High thermal and electrical conductivity
- Low sintering pressure for high yield manufacturing
- ALPHA® Argomax® 2047 Paste
Sinter Silver Paste for Package Sinter Attachment
- Application: Package/Module Attach, Substrate Attach
- Formulated for printing on Ag/Au surfaces
- Designed for component placement on wet paste with high tack
- Pure Silver bond line for high performance (thermal and electrical conductivity) and reliability
- Flexible bond line thickness
- Low sintering pressure for high yield manufacturing
- ALPHA® Argomax® 2040 Paste
Sinter Silver Paste for Die Attachment (Print and Dispense) with Wet Die Placement
- Applications: Die Attach, Die Top Attach
- Formulated for printing or dot dispense on Ag/Au surfaces
- Designed for die placement on wet paste
- Pure Silver bond line for high performance and reliability
- High thermal and electrical conductivity
- Low sintering pressure for high yield manufacturing
- Proven long stencil life
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