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Product Overview
ATROX® 800HT2VX is a hybrid silver sintered die attach paste with very high thermal conductivity, designed for high power semiconductor packages using metallized dies.
It has low resin bleed out and low condensable organics which ensure excellent package reliability
Product Features
- PFAS-Free / high viscosity dispensable paste for enabling controlled epoxy spread on a multitude of surfaces.
- Excellent process workability with thinner bond line thicknesses.
- High thermal conductivity for SiC, GaN higher efficiency power conversion devices.
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High Viscosity / Thixo
The high viscosity and thixotropic index (TI) of the material enable precise control over epoxy spread, ensuring tight management of the die-to-die and die-to-paddle distances. This formulation also effectively prevents die attach creep, maintaining the epoxy's position and preventing it from reaching the top of the die.
Sub-micron-sized particles Avg 1um
Sub-micron-sized particles size enables thinner Bond Line Thickness with improved voiding performance compared to micron-sized silver flakes filler.
Perfect for Automotive and 5G RF
Wide bandgap (WBG) semiconductor materials allow smaller, faster, more reliable power electronic components and with higher efficiency than their silicon-based counterparts
Engineered to Deliver Exceptional Thermal Conductivity
ATROX® 800HT2VX is a dispensable thermosetting die attach adhesive engineered to deliver exceptional thermal conductivity, exceeding 130 W/m-K in-package, making it ideal for high-power semiconductor packages with Ag and Au metallized dies. It offers excellent adhesion to a wide range of lead-frame and substrate surfaces, ensuring robust mechanical performance. The adhesive is designed to minimize resin bleed-out and outgassing during the curing process, enhancing package reliability. Additionally, it has proven moisture sensitivity level (MSL) and reliability performance, making it a dependable solution for demanding applications.
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