Technical Bulletins

专门为了实现优异板片外观，消除焊球和焊料桥接这两种芯片波峰焊常见缺陷而特别配方开发的。

No-Clean Flux for Lead-Free & Sn-Pb Wave Soldering specifically developed to deliver outstanding board cosmetics and to eliminate the tendency for solder balling and solder bridging, two types of defects which are normally associated with the use of the chip wave.

A no-clean wave soldering flux with low solid content developed for precision soldering in the electronics industry without the necessity of cleaning after soldering.

一款非常活跃的，低固态，免清洗助焊剂，采用专有活化剂配方而成。

A low solids, no-clean flux for wave soldering through-hole, mixed technology and surface mount assemblies; Has a unique formulation that provides high activity with virtually no visible residue and an extremely low level of solder balls with most solder masks; Leaves a tack-free surface with high surface insulation resistance

An organic activated, low residue soldering flux, which is specially designed for wave soldering conventional and surface mount assemblies.

A water-soluble liquid soldering flux principally designed for wave soldering of printed circuit boards.

Transparent flux for interconnecting cSi solar cells.

A halide-free, rosin/resin free, low solid, no-clean flux.