Technical Bulletins

一种不含卤化物，无松香/树脂，低固态含量的免清洗助焊剂，可用于通孔，混合技术和表面贴装组件的波峰焊。

An active low-solids, no clean flux.

A VOC-free, halide free, rosin/resin free, low solids, no-clean flux which provides the highest activity of any VOC-free Bellcore compliant for defect-free soldering.

A halide-free, rosin/resin free, low solid, no-clean flux for wave soldering through-hole, mixed technology and surface mount assemblies.

A halogen-free, rosin-free, low-solids, no-clean flux formulated for wave soldering and is well-suited for touch-up and rework when supplied in a flux pen.

An essentially VOC-free, halide-free, rosin/resin free, low-solids, no-clean flux.

a VOC-free halide-free, rosin/resin-free, low solids no-clean flux, which provides adequate activity. It is formulated with a proprietary mixture of organic activators and proprietary additives which deliver good wetting and top-side hole fill, significant reduction in solder bridging, solder balls, icicles and skips on difficult to solder assemblies.

A Halide-free, non-corrosive, low residue no-clean flux for touch up or rework of wave soldered or surface mount assemblies.

An essentially VOC-free, halide-free, rosin/resin free, low-solids, no-clean flux.

An essentially VOC-free, halide-free, rosin/resin free, low-solids, no-clean flux.

An essentially VOC-free, halide-free, rosin/resin free, low-solids, no-clean flux.

Specially developed to eliminate the tendency of solderballing and solder bridging.