Technical Bulletins

Specially developed to eliminate the tendency of solderballing and solder bridging.

Specially developed to eliminate the tendency of solderballing and solder bridging.

为了消除焊球和焊料桥接这两种与芯片焊相关最常见缺陷而特别开放的。

A VOC-free, halide free, rosin/resin free, low solids, no-clean flux.

High activity to ensure effective solder wetting on Kovar, Alloy 42, nickel and copper alloys.

A highly active water-based flux which is designed to ensure effective solder wetting on copper alloys.

An organic acid-based water-soluble flux containing no halogen as activator.

Solder Paste designed for blend with Type 5 (15 to 25µm)powder to meet market segments requiring ultra-fine application features.

Lead-Free Solder Paste for Fine Pitch Printing Application

Zero-Halogen, Low Voids, Ultra-Fine Feature, Excellent Pin Testable, High-Temperature-Stability Lead-Free Solder Paste.

A SAC305 capable paste designed to meet market segments requiring ultra-fine feature applications. 

Lead-Free Solder Paste for Photovoltaic Application.