Product Overview

ALPHA HT-130DHF-3 Adhesive is the leading surface mount adhesive for both printing and dispensing. It is ideal for high-speed dispensing processes given its non-slumping property.

It has been tested to provide excellent adhesion after curing & has the highest cured tensile strength.

 

 

 

 

Product Features

  • Leading surface mount adhesive for both printing and dispensing
  • Highest cured Tensile Strength
  • Excellent adhesion on common PCB board materials
  • Excellent thermal resistance during wave soldering process
  • Complies with RoHS Directive 2011/65/EU
  • Halogen-free
Technical Bulletins
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ALPHA HT-130DHF-3 Adhesives Technical Bulletin

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A dispensing & printing designed adhesive for holding components in soldering process

ALPHA HT-130DHF-3 Adhesive offers excellent adhesion strength at high temperature to prevent components from dropping off during wave soldering or SMT process.

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

ALPHA HiTech SM42-1311 Adhesive ALPHA HiTech SM42-120P Adhesive ALPHA HiTech AD13-9692B Adhesive ALPHA HiTech AD13-9521B ALPHA HiTech AD13-9620B Adhesive ALPHA HiTech AD43-9600W Adhesive ALPHA HiTech UP44-5566T Adhesive

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

ALPHA HiTech SM42-1311 Adhesive ALPHA HiTech SM42-120P Adhesive ALPHA HiTech AD13-9692B Adhesive ALPHA HiTech AD13-9521B ALPHA HiTech AD13-9620B Adhesive ALPHA HiTech AD43-9600W Adhesive ALPHA HiTech UP44-5566T Adhesive

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Gluing, Underfilling and Edgebonding Gluing SMT Components

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Gluing, Underfilling and Edgebonding Gluing SMT Components

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Low Temperature Adhesives High Reliability Adhesives Fine Feature Enabling Adhesives Halogen Free & Zero Halogen Products

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Low Temperature Adhesives High Reliability Adhesives Fine Feature Enabling Adhesives Halogen Free & Zero Halogen Products

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

ALPHA HiTech SM42-1311 Adhesive ALPHA HiTech SM42-120P Adhesive ALPHA HiTech AD13-9692B Adhesive ALPHA HiTech AD13-9521B ALPHA HiTech AD13-9620B Adhesive ALPHA HiTech AD43-9600W Adhesive ALPHA HiTech UP44-5566T Adhesive

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

ALPHA HiTech SM42-1311 Adhesive ALPHA HiTech SM42-120P Adhesive ALPHA HiTech AD13-9692B Adhesive ALPHA HiTech AD13-9521B ALPHA HiTech AD13-9620B Adhesive ALPHA HiTech AD43-9600W Adhesive ALPHA HiTech UP44-5566T Adhesive

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Gluing, Underfilling and Edgebonding Gluing SMT Components

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Gluing, Underfilling and Edgebonding Gluing SMT Components

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Low Temperature Adhesives High Reliability Adhesives Fine Feature Enabling Adhesives Halogen Free & Zero Halogen Products

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Low Temperature Adhesives High Reliability Adhesives Fine Feature Enabling Adhesives Halogen Free & Zero Halogen Products
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