Product Overview

ALPHA HiTech UP44-5566T is particularly suitable for Mobile Wireless Charger chip coating.

 

 

Product Features

  • Fast Cure under a UV Light Source
  • Excellent Adhesion
  • Halogen-free
  • Complies with RoHS Directive 2015/863/EU
Technical Bulletins
Documentation icon - Technical Bulletin

ALPHA HiTech UP44-5566T UV Cure Adhesive English

Download
Brochures
Documentation icon - Brochure

ALPHA HiTech Brochure English

Download
Documentation icon - Brochure

ALPHA HiTech 宣传册 简体中文

Download
AS_UP44-5566T_Promo Block

Ambient Temperature, Fast Curing process Adhesives

ALPHA HiTech UP44-5566T is for a curing process requiring instant curing process.  

With sufficient exposure to UV it can provide excellent adhesion strength  within seconds, a high throughput manufacturing process.  

Excellent adhesion to FR4, PMMA and Aluminum.

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

ALPHA HiTech AD13-9692B Adhesive ALPHA HiTech AD13-9521B ALPHA HiTech AD43-9600W Adhesive ALPHA HiTech AD13-9620B Adhesive ALPHA HiTech SM42-120P Adhesive ALPHA HiTech SM42-1311 Adhesive

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

ALPHA HiTech AD13-9692B Adhesive ALPHA HiTech AD13-9521B ALPHA HiTech AD43-9600W Adhesive ALPHA HiTech AD13-9620B Adhesive ALPHA HiTech SM42-120P Adhesive ALPHA HiTech SM42-1311 Adhesive

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Gluing, Underfilling and Edgebonding Gluing SMT Components

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Gluing, Underfilling and Edgebonding Gluing SMT Components

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Low Temperature Adhesives High Reliability Adhesives Fine Feature Enabling Adhesives Halogen Free & Zero Halogen Products

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Low Temperature Adhesives High Reliability Adhesives Fine Feature Enabling Adhesives Halogen Free & Zero Halogen Products

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

ALPHA HiTech AD13-9692B Adhesive ALPHA HiTech AD13-9521B ALPHA HiTech AD43-9600W Adhesive ALPHA HiTech AD13-9620B Adhesive ALPHA HiTech SM42-120P Adhesive ALPHA HiTech SM42-1311 Adhesive

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

ALPHA HiTech AD13-9692B Adhesive ALPHA HiTech AD13-9521B ALPHA HiTech AD43-9600W Adhesive ALPHA HiTech AD13-9620B Adhesive ALPHA HiTech SM42-120P Adhesive ALPHA HiTech SM42-1311 Adhesive

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Gluing, Underfilling and Edgebonding Gluing SMT Components

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Gluing, Underfilling and Edgebonding Gluing SMT Components

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Low Temperature Adhesives High Reliability Adhesives Fine Feature Enabling Adhesives Halogen Free & Zero Halogen Products

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Low Temperature Adhesives High Reliability Adhesives Fine Feature Enabling Adhesives Halogen Free & Zero Halogen Products
What do you need solved?
Let our experts find your solution.
Contact Us Form