Product Overview

ALPHA HiTech SM42-1311 is ideal for high-speed dispensing processes given its non-sagging property.

It has been tested to provide excellent adhesion after curing. This product can also be printed.

 

 

Product Features

  • Rheology specially designed for high throughput dispensing process
  • Excellent adhesion on common PCB board materials
  • Excellent thermal resistance during wave soldering process
  • Complies with RoHS Directive 2011/65/EU
  • Halogen-free
Technical Bulletins
Documentation icon - Technical Bulletin

ALPHA HiTech SM42-1311 Adhesive Technical Bulletin English

Documentation icon - Technical Bulletin

ALPHA HiTech SM42-1311 粘合剂 技术公告 简体中文

Brochures
Documentation icon - Brochure

ALPHA HiTech Brochure English

Documentation icon - Brochure

ALPHA HiTech 宣传册 简体中文

AS_SM42-1311_Promo Block

A dispensing designed adhesive for holding parts in soldering process

ALPHA HiTech SM42-1311 offers excellent adhesion strength at high temperature to prevent components from dropping off during wave soldering or SMT process.

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

ALPHA HiTech AD13-9692B Adhesive ALPHA HiTech AD13-9521B ALPHA HiTech AD13-9620B Adhesive ALPHA HiTech AD43-9600W Adhesive ALPHA HiTech SM42-120P Adhesive ALPHA HiTech UP44-5566T Adhesive

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

ALPHA HiTech AD13-9692B Adhesive ALPHA HiTech AD13-9521B ALPHA HiTech AD13-9620B Adhesive ALPHA HiTech AD43-9600W Adhesive ALPHA HiTech SM42-120P Adhesive ALPHA HiTech UP44-5566T Adhesive

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Gluing, Underfilling and Edgebonding Gluing SMT Components

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Gluing, Underfilling and Edgebonding Gluing SMT Components

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Low Temperature Adhesives High Reliability Adhesives Fine Feature Enabling Adhesives Halogen Free & Zero Halogen Products

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Low Temperature Adhesives High Reliability Adhesives Fine Feature Enabling Adhesives Halogen Free & Zero Halogen Products

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

ALPHA HiTech AD13-9692B Adhesive ALPHA HiTech AD13-9521B ALPHA HiTech AD13-9620B Adhesive ALPHA HiTech AD43-9600W Adhesive ALPHA HiTech SM42-120P Adhesive ALPHA HiTech UP44-5566T Adhesive

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

ALPHA HiTech AD13-9692B Adhesive ALPHA HiTech AD13-9521B ALPHA HiTech AD13-9620B Adhesive ALPHA HiTech AD43-9600W Adhesive ALPHA HiTech SM42-120P Adhesive ALPHA HiTech UP44-5566T Adhesive

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Gluing, Underfilling and Edgebonding Gluing SMT Components

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Gluing, Underfilling and Edgebonding Gluing SMT Components

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Low Temperature Adhesives High Reliability Adhesives Fine Feature Enabling Adhesives Halogen Free & Zero Halogen Products

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Low Temperature Adhesives High Reliability Adhesives Fine Feature Enabling Adhesives Halogen Free & Zero Halogen Products
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