Product Overview

NOVAFAB BA 800 is a sulfamate nickel via fill and/or barrier electroplating process that produces a pure, ductile, fine-grained, low stress nickel deposit required to meet the needs of the semiconductor industry for quality assured chemistry.

Features

  • Bright/smooth
  • High speed
  • Small grain size
  • Stress tunable
  • Excellent coplanarity
     

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NOVAFAB BA 800

Nickel plating- Macdermid Alpha

 

Plating Nickel -Macdermid Alpha

NOVAFAB BA 800

Product Name

Nickel Function

Ni Process Feature

EHS Friendly

NOVAFAB BA 800

Barrier Viafill

Bright - Smooth
High Speed
Small Grain size
Stress Tunable
Excellent Coplanarity

Lead Free
Boric Acid Alternative

Bright Barrier and Viafll

Building on MacDermid Alpha’s historic POR barrier technology and tool OEM BKM with the addition of Viafill capability.

Wafer Level Packaging System in Package (SiP) Power Semiconductor Sensors Heterogeneous Integration

Bright Barrier and Viafll

Building on MacDermid Alpha’s historic POR barrier technology and tool OEM BKM with the addition of Viafill capability.

Wafer Level Packaging System in Package (SiP) Power Semiconductor Sensors Heterogeneous Integration

Best in Class Barrier Performance

NOVAFAB BA 800 is a Ni Barrier to ensure KV free and stable intermetallic between the copper pillar and solder cap or C4 but with the added advantage of being stress tunable.

UBM Thermal Management Wafer Bumping Pillar / Post

Best in Class Barrier Performance

NOVAFAB BA 800 is a Ni Barrier to ensure KV free and stable intermetallic between the copper pillar and solder cap or C4 but with the added advantage of being stress tunable.

UBM Thermal Management Wafer Bumping Pillar / Post

Bright Barrier and Viafll

Building on MacDermid Alpha’s historic POR barrier technology and tool OEM BKM with the addition of Viafill capability.

Wafer Level Packaging System in Package (SiP) Power Semiconductor Sensors Heterogeneous Integration

Bright Barrier and Viafll

Building on MacDermid Alpha’s historic POR barrier technology and tool OEM BKM with the addition of Viafill capability.

Wafer Level Packaging System in Package (SiP) Power Semiconductor Sensors Heterogeneous Integration

Best in Class Barrier Performance

NOVAFAB BA 800 is a Ni Barrier to ensure KV free and stable intermetallic between the copper pillar and solder cap or C4 but with the added advantage of being stress tunable.

UBM Thermal Management Wafer Bumping Pillar / Post

Best in Class Barrier Performance

NOVAFAB BA 800 is a Ni Barrier to ensure KV free and stable intermetallic between the copper pillar and solder cap or C4 but with the added advantage of being stress tunable.

UBM Thermal Management Wafer Bumping Pillar / Post
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