Product Overview
NOVAFAB BA 800 is a sulfamate nickel via fill and/or barrier electroplating process that produces a pure, ductile, fine-grained, low stress nickel deposit required to meet the needs of the semiconductor industry for quality assured chemistry.
Features
- Bright/smooth
- High speed
- Small grain size
- Stress tunable
- Excellent coplanarity
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NOVAFAB BA 800
![Nickel plating- Macdermid Alpha](/sites/default/files/inline-images/SS_Nickel-category_novafab800-7.jpg)
![Plating Nickel -Macdermid Alpha](/sites/default/files/2021-07/SS_Nickel-category6.jpg)
NOVAFAB BA 800
Product Name |
Nickel Function |
Ni Process Feature |
EHS Friendly |
---|---|---|---|
NOVAFAB BA 800 |
Barrier Viafill |
Bright - Smooth |
Lead Free |