Product Overview

The MICROFAB SC-32 acid copper plating formulation provides excellent throwing power, improved leveling characteristics, and ductile low stress deposits.

Features

  • Good coplanarity
  • Versatility
  • Ease-of-use

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MICROFAB SC-32

Product Name

Cu Packaging Solution

Cu Process Feature

Feature-Property Benefit

MICROFAB SC-32

Pillar/Post
RDL

Good Coplanarity
Versatility

Ease-of-Use

Key Barrier Materials and Solders to Produce High Reliability Interconnects

  • Pillar/Post, RDL
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302 MICROFAB SC-40 MICROFAB SC-50

Key Barrier Materials and Solders to Produce High Reliability Interconnects

  • Pillar/Post, RDL
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302 MICROFAB SC-40 MICROFAB SC-50

Historical POR used on Flipchip Pillars and RDL patterns

Original formulation of MICROFAB SC is the foundation for higher speed versions; SC-32 and re-formulated SC-40 and SC-50.

Wafer Level Packaging System in Package (SiP) Heterogeneous Integration

Historical POR used on Flipchip Pillars and RDL patterns

Original formulation of MICROFAB SC is the foundation for higher speed versions; SC-32 and re-formulated SC-40 and SC-50.

Wafer Level Packaging System in Package (SiP) Heterogeneous Integration

Historical POR Wafer Bumping

Historical POR for WLP pillar, UBM and RDL features. Two-part additive system for ease of use.

UBM Backside Metal Wafer Bumping RDL Pillar / Post

Historical POR Wafer Bumping

Historical POR for WLP pillar, UBM and RDL features. Two-part additive system for ease of use.

UBM Backside Metal Wafer Bumping RDL Pillar / Post

Key Barrier Materials and Solders to Produce High Reliability Interconnects

  • Pillar/Post, RDL
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302 MICROFAB SC-40 MICROFAB SC-50

Key Barrier Materials and Solders to Produce High Reliability Interconnects

  • Pillar/Post, RDL
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302 MICROFAB SC-40 MICROFAB SC-50

Historical POR used on Flipchip Pillars and RDL patterns

Original formulation of MICROFAB SC is the foundation for higher speed versions; SC-32 and re-formulated SC-40 and SC-50.

Wafer Level Packaging System in Package (SiP) Heterogeneous Integration

Historical POR used on Flipchip Pillars and RDL patterns

Original formulation of MICROFAB SC is the foundation for higher speed versions; SC-32 and re-formulated SC-40 and SC-50.

Wafer Level Packaging System in Package (SiP) Heterogeneous Integration

Historical POR Wafer Bumping

Historical POR for WLP pillar, UBM and RDL features. Two-part additive system for ease of use.

UBM Backside Metal Wafer Bumping RDL Pillar / Post

Historical POR Wafer Bumping

Historical POR for WLP pillar, UBM and RDL features. Two-part additive system for ease of use.

UBM Backside Metal Wafer Bumping RDL Pillar / Post
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