Product Overview

MICROFAB AU100 DEPLATE is part of our gold plating program and is designed to reduce cost by selectively stripping gold seed metallization. This solution is specially formulated for gold seeds with Ti barrier metal (TA, Ti).

Features

  • Deplate only – Ti compatible
  • Uniform post gold seed etch
  • Lead-free
  • Arsenic-free
  • Cyanide-free
  • Thallium-free

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Plating Precious Metal-Macdermid Alpha

MICROFAB DEPLATE

Non-cyanide gold seed deplate for applications when non-uniformity is a must. This solution comes in two versions compatible with Ti/Au or TiW/Au and produces a uniform surface when paired with MICROFAB AU660.

MICROFAB AU100 DEPLATE

Product Name

PM Process Feature

PM Metal Property

PM EHS Friendly

MICROFAB AU100 DEPLATE

Deplate

Deplate Only - Ti Compatible
Uniform Post Gold Seed Etch

Lead-Free
Arsenic-Free
Cyanide-Free
Thallium-Free

Key Barrier Materials and Gold Plating Solutions

  • Backside metallization
  • Micro-LED
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB AU660 MICROFAB AU3151 B WH Neutronex N309 MICROFAB AU100CT Deplate

Key Barrier Materials and Gold Plating Solutions

  • Backside metallization
  • Micro-LED
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB AU660 MICROFAB AU3151 B WH Neutronex N309 MICROFAB AU100CT Deplate

Low COO and EHS Compliance

NOVAFAB and MICROFAB gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Power Semiconductor Sensors Optoelectronics Packaging

Low COO and EHS Compliance

NOVAFAB and MICROFAB gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Power Semiconductor Sensors Optoelectronics Packaging

Low COO and EHS Compliance

NOVAFAB and MICROFAB gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Thermal Management Backside Metal UBM Wafer Bumping

Low COO and EHS Compliance

NOVAFAB and MICROFAB gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Thermal Management Backside Metal UBM Wafer Bumping

Key Barrier Materials and Gold Plating Solutions

  • Backside metallization
  • Micro-LED
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB AU660 MICROFAB AU3151 B WH Neutronex N309 MICROFAB AU100CT Deplate

Key Barrier Materials and Gold Plating Solutions

  • Backside metallization
  • Micro-LED
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB AU660 MICROFAB AU3151 B WH Neutronex N309 MICROFAB AU100CT Deplate

Low COO and EHS Compliance

NOVAFAB and MICROFAB gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Power Semiconductor Sensors Optoelectronics Packaging

Low COO and EHS Compliance

NOVAFAB and MICROFAB gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Power Semiconductor Sensors Optoelectronics Packaging

Low COO and EHS Compliance

NOVAFAB and MICROFAB gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Thermal Management Backside Metal UBM Wafer Bumping

Low COO and EHS Compliance

NOVAFAB and MICROFAB gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Thermal Management Backside Metal UBM Wafer Bumping
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