Product Overview

MICROFAB Au3151B is a mild alkaline non-cyanide high purity hardness gold electroplating process that has proven reliability and bondability. MICROFAB Au3151B performs as high hardness gold bumping by adopting the organic hardness adjuster, which cannot be achieved with conventional gold processes.

Features

  • High speed deposition
  • High hardness
  • Uniform post gold seed etch

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Stable Plating Bath

Stable plating bath with easy bath maintenance, excellent uniformity and longer bath life.

Plating Precious Metal -Macdermid Alpha

MICROFAB AU3151B

Product Name

PM Process Feature

PM Metal Property

PM EHS Friendly

MICROFAB Au3151B

Uniform Post Gold Seed Etch
High Speed

High Hardness gold
High Purity – Soft Gold
High Thermal Stability
Low Surface Roughness

Lead-Free
Arsenic-Free
Cyanide-Free
Thallium-Free

Key Barrier Materials and Gold Plating Solutions

  • Backside metallization
  • Micro-LED
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB AU660 Neutronex N309 MICROFAB AU100 Deplate MICROFAB AU100CT Deplate

Key Barrier Materials and Gold Plating Solutions

  • Backside metallization
  • Micro-LED
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB AU660 Neutronex N309 MICROFAB AU100 Deplate MICROFAB AU100CT Deplate

Low COO and EHS Compliance

NOVAFAB and MICROFAB gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Power Semiconductor Sensors Optoelectronics Packaging

Low COO and EHS Compliance

NOVAFAB and MICROFAB gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Power Semiconductor Sensors Optoelectronics Packaging

Low COO and EHS Compliance

NOVAFAB and MICROFAB gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Thermal Management Backside Metal UBM Wafer Bumping

Low COO and EHS Compliance

NOVAFAB and MICROFAB gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Thermal Management Backside Metal UBM Wafer Bumping

Key Barrier Materials and Gold Plating Solutions

  • Backside metallization
  • Micro-LED
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB AU660 Neutronex N309 MICROFAB AU100 Deplate MICROFAB AU100CT Deplate

Key Barrier Materials and Gold Plating Solutions

  • Backside metallization
  • Micro-LED
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB AU660 Neutronex N309 MICROFAB AU100 Deplate MICROFAB AU100CT Deplate

Low COO and EHS Compliance

NOVAFAB and MICROFAB gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Power Semiconductor Sensors Optoelectronics Packaging

Low COO and EHS Compliance

NOVAFAB and MICROFAB gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Power Semiconductor Sensors Optoelectronics Packaging

Low COO and EHS Compliance

NOVAFAB and MICROFAB gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Thermal Management Backside Metal UBM Wafer Bumping

Low COO and EHS Compliance

NOVAFAB and MICROFAB gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Thermal Management Backside Metal UBM Wafer Bumping
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