NOVAFAB VIAFILL AU - Coming Soon

NOVAFAB VIAFILL AU is a mild alkaline non-cyanide gold electroplating process that produces deposits of 99.99% purity. NOVAFAB VIAFILL AU is specifically designed to fill via's with a conformal seed.

Features

  • Viafill capable
  • High purity – soft gold
  • Superior surface roughness
  • Lead-free
  • Arsenic-free
     

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Low Aspect Ratio Au Viafill

Precious Metal plating- Macdermid Alpha

 

NOVAFAB VIAFILL AU

Product Name

PM Process Feature

PM Metal Property

PM EHS Friendly

NOVAFAB VIAFILL AU

Viafill Capable

High Purity – Soft Gold
Superior Surface Roughness

Lead-Free
Arsenic-Free
Cyanide-Free
Thallium-Free

Low COO and EHS Compliance

NOVAFAB and MICROFAB gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Power Semiconductor Sensors Optoelectronics Packaging

Low COO and EHS Compliance

NOVAFAB and MICROFAB gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Power Semiconductor Sensors Optoelectronics Packaging

Low COO and EHS Compliance

NOVAFAB and MICROFAB gold solutions are systems created to work in conjunction with our nickel barrier and deplate systems to meet the demands of today’s semiconductor market.

Thermal Management Backside Metal UBM Wafer Bumping

Low COO and EHS Compliance

NOVAFAB and MICROFAB gold solutions are systems created to work in conjunction with our nickel barrier and deplate systems to meet the demands of today’s semiconductor market.

Thermal Management Backside Metal UBM Wafer Bumping

Low COO and EHS Compliance

NOVAFAB and MICROFAB gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Power Semiconductor Sensors Optoelectronics Packaging

Low COO and EHS Compliance

NOVAFAB and MICROFAB gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Power Semiconductor Sensors Optoelectronics Packaging

Low COO and EHS Compliance

NOVAFAB and MICROFAB gold solutions are systems created to work in conjunction with our nickel barrier and deplate systems to meet the demands of today’s semiconductor market.

Thermal Management Backside Metal UBM Wafer Bumping

Low COO and EHS Compliance

NOVAFAB and MICROFAB gold solutions are systems created to work in conjunction with our nickel barrier and deplate systems to meet the demands of today’s semiconductor market.

Thermal Management Backside Metal UBM Wafer Bumping
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