Product Overview

ALPHA HiTech EN21-4210F has a high hardness property which makes it very suitable for assembly of components requiring excellent reinforcement strength.

ALPHA HiTech EN21-4210 Series is a non-reworkable encapsulant product option.

 

 

 

 

Product Features

  • Excellent Adhesion Strength
  • Impart Waterproofing Property
  • Resists Migration in Flux Residue
  • Halogen-free & complies with RoHS Directive 2015/863/EU
Technical Bulletins
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ALPHA HiTech EN21-4210F Encapsulant Technical Bulletin English

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Brochures
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ALPHA HiTech Brochure English

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ALPHA HiTech 宣传册 简体中文

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Encapsulant for reinforcement and environmental protection

ALPHA HiTech EN21-4210F Encapsulant can provide the necessary coverage to some areas in the assembly requiring water proofing property.  

It can also inhibit any migration that may arise from flux residue.  Encapsulated chip component can be protected from cracking.  It has excellent adhesion on metals and FR4

 

AS_EN21-4210F_Promo Block

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

ALPHA HiTech AD13-9521B ALPHA HiTech AD43-9600W Adhesive ALPHA HiTech SM42-120P Adhesive ALPHA HiTech SM42-1311 Adhesive ALPHA HiTech UP44-5566T Adhesive ALPHA HiTech EN31-4007B Encapsulant ALPHA HiTech AD13-9692B Adhesive ALPHA HiTech AD13-9620B Adhesive

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

ALPHA HiTech AD13-9521B ALPHA HiTech AD43-9600W Adhesive ALPHA HiTech SM42-120P Adhesive ALPHA HiTech SM42-1311 Adhesive ALPHA HiTech UP44-5566T Adhesive ALPHA HiTech EN31-4007B Encapsulant ALPHA HiTech AD13-9692B Adhesive ALPHA HiTech AD13-9620B Adhesive

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Gluing, Underfilling and Edgebonding Gluing SMT Components

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Gluing, Underfilling and Edgebonding Gluing SMT Components

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Low Temperature Adhesives High Reliability Adhesives Fine Feature Enabling Adhesives Halogen Free & Zero Halogen Products

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Low Temperature Adhesives High Reliability Adhesives Fine Feature Enabling Adhesives Halogen Free & Zero Halogen Products

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

ALPHA HiTech AD13-9521B ALPHA HiTech AD43-9600W Adhesive ALPHA HiTech SM42-120P Adhesive ALPHA HiTech SM42-1311 Adhesive ALPHA HiTech UP44-5566T Adhesive ALPHA HiTech EN31-4007B Encapsulant ALPHA HiTech AD13-9692B Adhesive ALPHA HiTech AD13-9620B Adhesive

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

ALPHA HiTech AD13-9521B ALPHA HiTech AD43-9600W Adhesive ALPHA HiTech SM42-120P Adhesive ALPHA HiTech SM42-1311 Adhesive ALPHA HiTech UP44-5566T Adhesive ALPHA HiTech EN31-4007B Encapsulant ALPHA HiTech AD13-9692B Adhesive ALPHA HiTech AD13-9620B Adhesive

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Gluing, Underfilling and Edgebonding Gluing SMT Components

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Gluing, Underfilling and Edgebonding Gluing SMT Components

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Low Temperature Adhesives High Reliability Adhesives Fine Feature Enabling Adhesives Halogen Free & Zero Halogen Products

ALPHA HiTech Adhesives cover a wide range of applications for holding in place chip components or bonding devices at varying curing conditions.

ALPHA HiTech  Encapsulants are one component, intermediate temperature, fast heat curable materials designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.

Low Temperature Adhesives High Reliability Adhesives Fine Feature Enabling Adhesives Halogen Free & Zero Halogen Products
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