Product Overview

MICROFAB AU660 is a mild alkaline non-cyanide gold electroplating process that produces deposits of 99.99% purity. MICROFAB AU660 is frequently used in bump plating on metalized silicon wafers.

Features

  • High speed gold deposition
  • Superior step coverage
  • Uniform post gold seed etch 

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Plating Precious Metal-Macdermid Alpha

Surface Roughness Adjustable and Capable

MICROFAB AU660 is also surface roughness adjustable and capable of < 20nm Ra. This solution is perfectly paired with MICROFAB AU100 DEPLATE for superior seed removal uniformity.

  • 1.5 – 2.0X improved step coverage
  • High plating rates > than 0.5 um/min
  • Cyanide free
  • Uniform post seed etch surface roughness

MICROFAB AU660

Product Name

PM Process Feature

PM Metal Property

PM EHS Friendly

MICROFAB AU660

Uniform Post Gold Seed Etch
High Speed
Superior Step Coverage

High Purity – Soft Gold
Columnar
Low Surface Roughness

Lead-Free
Arsenic-Free
Cyanide-Free

Key Barrier Materials and Gold Plating Solutions

  • Backside metallization
  • Micro-LED
  • Uniform post gold seed etch
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB AU3151 B WH Neutronex N309 MICROFAB AU100 Deplate MICROFAB AU100CT Deplate

Key Barrier Materials and Gold Plating Solutions

  • Backside metallization
  • Micro-LED
  • Uniform post gold seed etch
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB AU3151 B WH Neutronex N309 MICROFAB AU100 Deplate MICROFAB AU100CT Deplate

Low COO and EHS Compliance

NOVAFAB and MICROFAB gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Power Semiconductor Sensors Optoelectronics Packaging

Low COO and EHS Compliance

NOVAFAB and MICROFAB gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Power Semiconductor Sensors Optoelectronics Packaging

Low COO and EHS Compliance

NOVAFAB and MICROFAB gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Thermal Management Backside Metal UBM Wafer Bumping

Low COO and EHS Compliance

NOVAFAB and MICROFAB gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Thermal Management Backside Metal UBM Wafer Bumping

Key Barrier Materials and Gold Plating Solutions

  • Backside metallization
  • Micro-LED
  • Uniform post gold seed etch
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB AU3151 B WH Neutronex N309 MICROFAB AU100 Deplate MICROFAB AU100CT Deplate

Key Barrier Materials and Gold Plating Solutions

  • Backside metallization
  • Micro-LED
  • Uniform post gold seed etch
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB AU3151 B WH Neutronex N309 MICROFAB AU100 Deplate MICROFAB AU100CT Deplate

Low COO and EHS Compliance

NOVAFAB and MICROFAB gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Power Semiconductor Sensors Optoelectronics Packaging

Low COO and EHS Compliance

NOVAFAB and MICROFAB gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Power Semiconductor Sensors Optoelectronics Packaging

Low COO and EHS Compliance

NOVAFAB and MICROFAB gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Thermal Management Backside Metal UBM Wafer Bumping

Low COO and EHS Compliance

NOVAFAB and MICROFAB gold solutions are EHS compliant systems created to meet the demands of today’s semiconductor quality needs.

Thermal Management Backside Metal UBM Wafer Bumping
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