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Product Overview
MICROFAB AU310-T is a mild alkaline non-cyanide, gold electroplating process that produces deposits of 99.99% purity.
MICROFAB AU310-T is frequently used in bump plating on metalized silicon wafers
Features
- High purity – soft gold
- Columnar
- Superior surface roughness
- Uniform post gold seed etch
- Lead-free
- Arsenic-free
- Cyanide-free
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MICROFAB AU310-T
|
Product Name |
PM Process Feature |
PM Metal Property |
PM EHS Friendly |
|---|---|---|---|
|
MICROFAB AU310-T |
Uniform Post Gold Seed Etch |
High Purity – Soft Gold Columnar Superior Surface Roughness |
Lead-Free Arsenic-Free Cyanide-Free |
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