Plating-Copper-Macdermid Alpha

NOVAFAB NANOTWIN Cu – Bump-less

Nano-twinned Cu (nt-Cu) demonstrates superior mechanical and electrical properties and has drawn a lot of attention in the wafer-level packaging (WLP) field for Cu to Cu direct and hybrid bonding. D2D, D2W applications and redistribution line (RDL) anti-cracking can benefit from improved electromigration resistance. Performance and thermal demands driving I/O pitch reduction and I/O density increases lead to solder removal at reduced pitch size.

  • 111 oriented crystal structure.
  • Highly stable one-part novel additive system.
  • High speed deposition.

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MICROFAB SPM-1100

MICROFAB SPM-1100 copper plating solution demonstrates superior high-speed plating and coplanarity in a KV low system which provides exceptional within-wafer, within-die, and within-feature uniformity. MICROFAB SPM-1100 is a next generation high speed solution and is a perfect replacement for industry leading MICROFAB SC copper solutions where >COP and plating rate is desired. It is also perfectly mated with our boric acid free nickel barrier, MICROFAB EVF NiBar and tin silver solutions MICROFAB TS-650

  • Flat bump shape.
  • Excellent coplanarity.
  • High speed deposition.

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Plating Copper-Macdermid Alpha

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  • MICROFAB® SC

    Copper plating process for copper pillar in flip chip package, copper microbump as well as redistribution layer. The process delivers accurate bump height uniformity and bump shape control.

    • Good coplanarity
    • Versatility
    • Ease-of-use
  • MICROFAB® GSW-200

    MICROFAB GSW-200 is a mid-purity plating system that can be used with or without a Ni barrier. The solutions ability to level the pad reduces the amount of solder needed leading to a lower cost of ownership.

    • Excellent bottom up fill
    • Flat bump shape
  • MICROFAB® DVF-200

    MICROFAB DVF-200 excels at bottom up fill and versatility. Created for a variety of aspect ratios for TSV and interposer applications, this solution can be used in combination with our RDLV Series and Nanotwin Cu systems.

    • Excellent bottom up fill
    • Versatility
    • Ease-of-use
  • MICROFAB® RDLV Series

    The MICROFAB RDLV Series offers three solutions to have best-in-class performance for the simultaneous plating of RDL lines and filling of vias across a wide range of line, space and via dimensions.

    • 2 in 1 RDL
    • Excellent bottom up fill
    • Excellent coplanarity
    • Versatility
    • Low voiding
    • Flat bump shape
    • Low-line doming
  • NOVAFAB® HPM-500

    NOVAFAB HPM-500 copper plating solution demonstrates superior coplanarity in a KV low system which provides exceptional within-die, and within-feature uniformity.

    • Best-in-class coplanarity
    • High purity
  • MICROFAB® Pure BP

    MICROFAB Pure BP is MacDermid Alpha’s pure copper offering with high KV resistance designed for copper pillars without the need for a Ni barrier between the copper pillar and solder cap.

    • High purity
    • Void free
  • MICROFAB® MP-2500

    As Wafer Level Packing technology continues to expand, MacDermid Alpha is growing it’s WLP portfolio of innovation driven by heterogeneous packages. MICROFAB MP-2500 allows interconnection of 2.5D and 3D wafer level fan-out and PoP technology that need thermal management for high performance and high reliability.

    • High speed
    • High purity
    • Flat bump shape
    • Thermal pillar
    • Excellent coplanarity
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