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NOVAFAB NANOTWIN Cu – Bump-less
Nano-twinned Cu (nt-Cu) demonstrates superior mechanical and electrical properties and has drawn a lot of attention in the wafer-level packaging (WLP) field for Cu to Cu direct and hybrid bonding. D2D, D2W applications and redistribution line (RDL) anti-cracking can benefit from improved electromigration resistance. Performance and thermal demands driving I/O pitch reduction and I/O density increases lead to solder removal at reduced pitch size.
- 111 oriented crystal structure.
- Highly stable one-part novel additive system.
- High speed deposition.
MICROFAB SPM-1100
MICROFAB SPM-1100 copper plating solution demonstrates superior high-speed plating and coplanarity in a KV low system which provides exceptional within-wafer, within-die, and within-feature uniformity. MICROFAB SPM-1100 is a next generation high speed solution and is a perfect replacement for industry leading MICROFAB SC copper solutions where >COP and plating rate is desired. It is also perfectly mated with our boric acid free nickel barrier, MICROFAB EVF NiBar and tin silver solutions MICROFAB TS-650
- Flat bump shape.
- Excellent coplanarity.
- High speed deposition.
View Products in Plating - Copper
- MICROFAB® SC
Copper plating process for copper pillar in flip chip package, copper microbump as well as redistribution layer. The process delivers accurate bump height uniformity and bump shape control.
- Good coplanarity
- Versatility
- Ease-of-use
- MICROFAB® GSW-200
MICROFAB GSW-200 is a mid-purity plating system that can be used with or without a Ni barrier. The solutions ability to level the pad reduces the amount of solder needed leading to a lower cost of ownership.
- Excellent bottom up fill
- Flat bump shape
- MICROFAB® DVF-200
MICROFAB DVF-200 excels at bottom up fill and versatility. Created for a variety of aspect ratios for TSV and interposer applications, this solution can be used in combination with our RDLV Series and Nanotwin Cu systems.
- Excellent bottom up fill
- Versatility
- Ease-of-use
- MICROFAB® RDLV Series
The MICROFAB RDLV Series offers three solutions to have best-in-class performance for the simultaneous plating of RDL lines and filling of vias across a wide range of line, space and via dimensions.
- 2 in 1 RDL
- Excellent bottom up fill
- Excellent coplanarity
- Versatility
- Low voiding
- Flat bump shape
- Low-line doming
- NOVAFAB® HPM-500
NOVAFAB HPM-500 copper plating solution demonstrates superior coplanarity in a KV low system which provides exceptional within-die, and within-feature uniformity.
- Best-in-class coplanarity
- High purity
- MICROFAB® Pure BP
MICROFAB Pure BP is MacDermid Alpha’s pure copper offering with high KV resistance designed for copper pillars without the need for a Ni barrier between the copper pillar and solder cap.
- High purity
- Void free
- MICROFAB® MP-2500
As Wafer Level Packing technology continues to expand, MacDermid Alpha is growing it’s WLP portfolio of innovation driven by heterogeneous packages. MICROFAB MP-2500 allows interconnection of 2.5D and 3D wafer level fan-out and PoP technology that need thermal management for high performance and high reliability.
- High speed
- High purity
- Flat bump shape
- Thermal pillar
- Excellent coplanarity
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