Leading Solder Preforms for Selectively Increasing Solder Volume
- Repeatable solder volume precision
- Minimize Flux residue
- Low voiding
- Thermal management
- Highly customizable configuration
PRODUCT NAME | DESCRIPTION | KEY FEATURES |
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ALPHA Exactalloy Tape & Reel Preforms | Offering increased solder volume for joint reliability, reduced flux residue for improved electrical reliability, and void reduction under component thermal pads. |
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ALPHA AccuFlux BTC-578 Solder Preforms | Technology designed specifically to produce lower void results at the thermal/ground interface of Bottom Terminated Component packages such as QFN, QFP, and D-Pak. |
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