Selectively Increasing Solder Volume - SMT
During assembly, some components benefit from the addition of small amounts of solder to enhance joint strength, reduce voiding and / or address non-wet opens related to component warpage. We offer customized, pre-fluxed or unfluxed solder preform solutions that can be seamlessly implemented into current SMT processes.
Leading Solder Preforms for Selectively Increasing Solder Volume
- Repeatable solder volume precision
- Minimize Flux residue
- Low voiding
- Thermal management
- Highly customizable configuration
PRODUCT NAME | DESCRIPTION | KEY FEATURES |
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ALPHA Exactalloy Tape & Reel Preforms | Offering increased solder volume for joint reliability, reduced flux residue for improved electrical reliability, and void reduction under component thermal pads. |
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ALPHA AccuFlux BTC-578 Solder Preforms | Technology designed specifically to produce lower void results at the thermal/ground interface of Bottom Terminated Component packages such as QFN, QFP, and D-Pak. |
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Associated Products
- Solder Pastes
- Cored Wire
- Solder Preforms
- Edgebond & Underfills
Associated Products
- Solder Pastes
- Cored Wire
- Solder Preforms
- Edgebond & Underfills
We provide the right set of materials, as well as, the guidance and field support to help you optimize your assembly process. The result: high throughput, high yield production, high efficiency, and high reliability.
We provide the right set of materials, as well as, the guidance and field support to help you optimize your assembly process. The result: high throughput, high yield production, high efficiency, and high reliability.
As the leading innovator for materials in a wide range of industries, we offer a multitude of solutions to provide customers with latest technologies and materials to meet their goals for reliability, performance, cost efficiency and sustainability.
As the leading innovator for materials in a wide range of industries, we offer a multitude of solutions to provide customers with latest technologies and materials to meet their goals for reliability, performance, cost efficiency and sustainability.
Associated Products
- Solder Pastes
- Cored Wire
- Solder Preforms
- Edgebond & Underfills
Associated Products
- Solder Pastes
- Cored Wire
- Solder Preforms
- Edgebond & Underfills
We provide the right set of materials, as well as, the guidance and field support to help you optimize your assembly process. The result: high throughput, high yield production, high efficiency, and high reliability.
We provide the right set of materials, as well as, the guidance and field support to help you optimize your assembly process. The result: high throughput, high yield production, high efficiency, and high reliability.
As the leading innovator for materials in a wide range of industries, we offer a multitude of solutions to provide customers with latest technologies and materials to meet their goals for reliability, performance, cost efficiency and sustainability.
As the leading innovator for materials in a wide range of industries, we offer a multitude of solutions to provide customers with latest technologies and materials to meet their goals for reliability, performance, cost efficiency and sustainability.
Let our experts find your solution.