Mobile Phones and Wearable Devices

Mobile devices represent the leading edge of assembly technology due to their size and complexity. Manufacturers of mobile phones and wearable devices value high performance and sustainable solder materials, as well as, creative solutions to enable this miniaturization trend.

Key Requirements for Joining Materials

High mechanical and electrical reliability
Fine feature capable
Product options to enable flexibility in board design and manufacturing process
Excellent value, lowers total cost of ownership

Product Type	Product Name	Low Temp	PB Free	Halogen Free
Solder Paste	ALPHA OM-353 SAC305 / SACX Plus 0307 Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Lowest post reflow residues of Alpha’s chemistries Low HIP and NWO Defects		Image	Image
Solder Paste	ALPHA OM-372 SAC305 Best-in-class electrochemical reliability on fine pitched low standoff packages Ultra-fine feature printing & reflow capability down to 008004 components Minimum post reflow residue provides high reliability performance for fine pitch, high density designs	Image	Image	Image
Solder Paste	ALPHA OM-565 HRL3 Compatibility with HRL3 alloy for enhanced thermomechanical and drop shock reliability over existing low temperature solders HRL3 alloy enables peak reflow temperature of 175 °C to mitigate warpage induced defects Low melt point reflow improves energy efficiency in assembly process Compatibility with contact rework applications
Solder Paste	ALPHA JP-500 SAC305 Jettable to 0.5mm/.020” pitch Excellent deposit consistency with high process capability index across all board designs Reduction in random solderballing levels, increasing first time yield		Image	Image
Solder Paste	ALPHA JP-501 SnBiAg Low HIP and NWO Defects Jettable to 0.5mm/.020” pitch	Image	Image	Image
Solder Preforms	ALPHA Accuflux BTC-578 Solder Preforms Increase thermal conductivity and heat dissipation through void reduction Low flux residue improves electrochemical reliability Prevents mechanical stack-up issues through increased solder volume
Solder Preforms	ALPHA Exactalloy Tape and Reel Preforms High solder volume precision and production yields using pick and place Available in many alloys, sizes and shapes	Image	Image	Image
Cored Wire	ALPHA Telecore HF-850 SAC305 / SACX Plus 0307 Performs well with all standard pad finishes Can be used in both robotic and manual soldering processes ROL0		Image	Image
Cored Wire	ALPHA Telecore XL-825 SAC305 / SACX Plus 0307 Best for difficult to solder surfaces Can be used in both robotic and manual soldering processes ROL1		Image
Cored Wire	Kester 268 SAC305/K100LD Optimzed for low spatter robotic soldering Can be used for manual and automated soldering processes Zero halogen ROL0
Cored Wire	Kester 285 SAC305 Highly active for soldering difficult surfaces while retaining ROL0 class Can be used for manual and automated soldering processes ROL0
Underfill	ALPHA HiTech CU31-2030 Fast flow Excellent Thermal Shock and Drop Shock Resistance Reworkable			Image
Edgebond	ALPHA HiTech CF31-4010 Excellent High Thermal Resistance
Encapsulant	ALPHA HiTech EN31-4007B Excellent Impact Bend Resistance 20-day Pot Life Reworkable			Image
Encapsulant	ALPHA HiTech EN21-4210F Excellent High Thermal Resistance
Bar & Solid Wire Solder	ALPHA SAC305 Excellent soldering performance High thermal fatigue resistance Widely used
Bar & Solid Wire Solder	ALPHA SACX Plus 0807 Low Silver (0.8%) for improved value vs. SAC305 SAC305-like soldering and reliability performance on complex assemblies Low Copper dissolution and low drossing
Bar & Solid Wire Solder	ALPHA HRL3 Low temperature enabling in selective and dip soldering processes Provides efficiencies in energy savings and reduces thermal damage Comparable hole fill performance and solder joint strength vs SAC305 Low Copper erosion vs SAC305
Liquid Flux	ALPHA EF-6808HF ROL0 Passes SIR IPC J-STD-004B Excellent for most standard complexity assemblies
Liquid Flux	ALPHA EF-8800HF ORL0 Passes SIR IPC J-STD-004B Designed for thick, complex boards
Liquid Flux	Kester NF372-TB ROL0 Passes SIR IPC J-STD-004B Sustained flux activity in challenging heating profile

Printing Dispensing & Jetting Gluing, Underfilling and Edgebonding Selectively Increasing Solder Volume - SMT

Key Requirements for Joining Materials

High mechanical and electrical reliability
Fine feature capable
Product options to enable flexibility in board design and manufacturing process
Excellent value, lowers total cost of ownership

Product Type	Product Name	Low Temp	PB Free	Halogen Free
Solder Paste	ALPHA OM-353 SAC305 / SACX Plus 0307 Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Lowest post reflow residues of Alpha’s chemistries Low HIP and NWO Defects		Image	Image
Solder Paste	ALPHA OM-372 SAC305 Best-in-class electrochemical reliability on fine pitched low standoff packages Ultra-fine feature printing & reflow capability down to 008004 components Minimum post reflow residue provides high reliability performance for fine pitch, high density designs	Image	Image	Image
Solder Paste	ALPHA OM-565 HRL3 Compatibility with HRL3 alloy for enhanced thermomechanical and drop shock reliability over existing low temperature solders HRL3 alloy enables peak reflow temperature of 175 °C to mitigate warpage induced defects Low melt point reflow improves energy efficiency in assembly process Compatibility with contact rework applications
Solder Paste	ALPHA JP-500 SAC305 Jettable to 0.5mm/.020” pitch Excellent deposit consistency with high process capability index across all board designs Reduction in random solderballing levels, increasing first time yield		Image	Image
Solder Paste	ALPHA JP-501 SnBiAg Low HIP and NWO Defects Jettable to 0.5mm/.020” pitch	Image	Image	Image
Solder Preforms	ALPHA Accuflux BTC-578 Solder Preforms Increase thermal conductivity and heat dissipation through void reduction Low flux residue improves electrochemical reliability Prevents mechanical stack-up issues through increased solder volume
Solder Preforms	ALPHA Exactalloy Tape and Reel Preforms High solder volume precision and production yields using pick and place Available in many alloys, sizes and shapes	Image	Image	Image
Cored Wire	ALPHA Telecore HF-850 SAC305 / SACX Plus 0307 Performs well with all standard pad finishes Can be used in both robotic and manual soldering processes ROL0		Image	Image
Cored Wire	ALPHA Telecore XL-825 SAC305 / SACX Plus 0307 Best for difficult to solder surfaces Can be used in both robotic and manual soldering processes ROL1		Image
Cored Wire	Kester 268 SAC305/K100LD Optimzed for low spatter robotic soldering Can be used for manual and automated soldering processes Zero halogen ROL0
Cored Wire	Kester 285 SAC305 Highly active for soldering difficult surfaces while retaining ROL0 class Can be used for manual and automated soldering processes ROL0
Underfill	ALPHA HiTech CU31-2030 Fast flow Excellent Thermal Shock and Drop Shock Resistance Reworkable			Image
Edgebond	ALPHA HiTech CF31-4010 Excellent High Thermal Resistance
Encapsulant	ALPHA HiTech EN31-4007B Excellent Impact Bend Resistance 20-day Pot Life Reworkable			Image
Encapsulant	ALPHA HiTech EN21-4210F Excellent High Thermal Resistance
Bar & Solid Wire Solder	ALPHA SAC305 Excellent soldering performance High thermal fatigue resistance Widely used
Bar & Solid Wire Solder	ALPHA SACX Plus 0807 Low Silver (0.8%) for improved value vs. SAC305 SAC305-like soldering and reliability performance on complex assemblies Low Copper dissolution and low drossing
Bar & Solid Wire Solder	ALPHA HRL3 Low temperature enabling in selective and dip soldering processes Provides efficiencies in energy savings and reduces thermal damage Comparable hole fill performance and solder joint strength vs SAC305 Low Copper erosion vs SAC305
Liquid Flux	ALPHA EF-6808HF ROL0 Passes SIR IPC J-STD-004B Excellent for most standard complexity assemblies
Liquid Flux	ALPHA EF-8800HF ORL0 Passes SIR IPC J-STD-004B Designed for thick, complex boards
Liquid Flux	Kester NF372-TB ROL0 Passes SIR IPC J-STD-004B Sustained flux activity in challenging heating profile

Printing Dispensing & Jetting Gluing, Underfilling and Edgebonding Selectively Increasing Solder Volume - SMT

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Mobile Phones and Wearable Devices

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