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Powertrain related electronic systems are regularly exposed to high temperature (>120°C) and vibration. Joining materials used in these systems must exhibit the highest level of mechanical reliability under these extreme conditions.

Key Requirements

Reliability in high temperature, high vibration conditions
High electrochemical reliability alone and in combination with other joining materials
High thermal and electrical conductivity

Product Type	Product Name	PB Free	Halogen Free	VOC Free
Solder Paste	ALPHA CVP-390V Innolot Excellent electrochemical reliability down to 0.100mm spacing Fine feature printability down to 01005 feature size Highest thermo-mechanical reliability at temperatures above 120°C (Innolot)	Image	Image
Solder Paste	ALPHA OM-353 Innolot Lowest post reflow residue spread of Alpha’s chemistries Excellent electrochemical reliability down to 0.200mm spacing Low HIP and NWO Defects Highest thermo-mechanical reliability at temperatures above 120°C (Innolot)	Image	Image
Solder Preforms	ALPHA BTC-578 Accuflux Preforms Innolot / SAC305 Increasing thermal conductivity and heat dissipation through void reduction Low flux residue improves electrochemical reliability Prevents mechanical stackup issues through increased solder volume	Image	Image
Solder Preforms	ALPHA Tape and Reel Preforms High solder volume precision and production yields using pick and place Available in many alloys, sizes and shapes	Image	Image
Cored Wire	ALPHA Telecore HF-850 Innolot / SAC305 Performs well with all standard pad finishes Can be used in both robotic and manual soldering processes ROL0	Image	Image
Cored Wire	ALPHA Telecore XL-825 SAC305 Best for difficult to solder surfaces Can be used in both robotic and manual soldering processes ROL1	Image
Cored Wire	Kester 268 SAC305 Optimzed for low spatter robotic soldering Can be used for manual and automated soldering processes Zero halogen ROL0
Cored Wire	Kester 285 SAC305 Highly active for soldering difficult surfaces while retaining ROL0 class Can be used for manual and automated soldering processes ROL0
Underfill	ALPHA HiTech CU21-3240 Excellent High Thermal Shock Resistance
Edgebond	ALPHA HiTech CF31-4010 Excellent High Thermal Resistance
Adhesive	ALPHA HiTech SM42-1311 SMD Adhesive Non-Sagging Excellent adhesion on FR4 Resists change due to high heat post application processing (i.e., wave soldering)		Image
Adhesive	ALPHA HiTech SM42-120P SMD Adhesive Non-Sagging Excellent adhesion on FR4 Resists change due to high heat post application processing (i.e., wave soldering)		Image
Bar & Solid Wire Solder	ALPHA SAC305 Excellent soldering performance High thermal fatigue resistance Widely used	Image
Bar & Solid Wire Solder	ALPHA SACX Plus 0807 Low Silver (0.8%) for improved value vs. SAC305 SAC305-like soldering and reliability performance on complex assemblies Low Copper dissolution and low drossing	Image
Liquid Flux	ALPHA EF-2100 ORL0 VOC free Passes SIR IPC J-STD-004B Wide process window	Image	Image	Image
Liquid Flux	ALPHA EF-6000 ORL0 Passes SIR IPC J-STD-004 High activity, rosin-free formula can be cleaned with DI water	Image
Liquid Flux	ALPHA EF-6808HF ROL0 Passes SIR IPC J-STD-004B Excellent for most standard complexity assemblies	Image	Image
Liquid Flux	ALPHA EF-8800HF ORL0 Passes SIR IPC J-STD-004B Designed for thick boards
Liquid Flux	Kester 951 ORL0 Passes SIR IPC J-STD-004 Rosin-free formula for clean post-soldering surface	Image	Image
Liquid Flux	Kester NF1060-VF ORM0 VOC free Passes SIR IPC J-STD-004B Exceptional wetting with excellent hole-fill
Liquid Flux	Kester 985M ORM0 Passes SIR IPC J-STD-004B Excellent solderability even on high density board
Liquid Flux	Kester NF372-TB ROL0 Passes SIR IPC J-STD-004B Sustained flux activity in challenging heating profile

Printing Dispensing & Jetting Gluing, Underfilling and Edgebonding Selectively Increasing Solder Volume - SMT

Reduced Voiding in Solder Joints

Key Requirements

Reliability in high temperature, high vibration conditions
High electrochemical reliability alone and in combination with other joining materials
High thermal and electrical conductivity

Product Type	Product Name	PB Free	Halogen Free	VOC Free
Solder Paste	ALPHA CVP-390V Innolot Excellent electrochemical reliability down to 0.100mm spacing Fine feature printability down to 01005 feature size Highest thermo-mechanical reliability at temperatures above 120°C (Innolot)	Image	Image
Solder Paste	ALPHA OM-353 Innolot Lowest post reflow residue spread of Alpha’s chemistries Excellent electrochemical reliability down to 0.200mm spacing Low HIP and NWO Defects Highest thermo-mechanical reliability at temperatures above 120°C (Innolot)	Image	Image
Solder Preforms	ALPHA BTC-578 Accuflux Preforms Innolot / SAC305 Increasing thermal conductivity and heat dissipation through void reduction Low flux residue improves electrochemical reliability Prevents mechanical stackup issues through increased solder volume	Image	Image
Solder Preforms	ALPHA Tape and Reel Preforms High solder volume precision and production yields using pick and place Available in many alloys, sizes and shapes	Image	Image
Cored Wire	ALPHA Telecore HF-850 Innolot / SAC305 Performs well with all standard pad finishes Can be used in both robotic and manual soldering processes ROL0	Image	Image
Cored Wire	ALPHA Telecore XL-825 SAC305 Best for difficult to solder surfaces Can be used in both robotic and manual soldering processes ROL1	Image
Cored Wire	Kester 268 SAC305 Optimzed for low spatter robotic soldering Can be used for manual and automated soldering processes Zero halogen ROL0
Cored Wire	Kester 285 SAC305 Highly active for soldering difficult surfaces while retaining ROL0 class Can be used for manual and automated soldering processes ROL0
Underfill	ALPHA HiTech CU21-3240 Excellent High Thermal Shock Resistance
Edgebond	ALPHA HiTech CF31-4010 Excellent High Thermal Resistance
Adhesive	ALPHA HiTech SM42-1311 SMD Adhesive Non-Sagging Excellent adhesion on FR4 Resists change due to high heat post application processing (i.e., wave soldering)		Image
Adhesive	ALPHA HiTech SM42-120P SMD Adhesive Non-Sagging Excellent adhesion on FR4 Resists change due to high heat post application processing (i.e., wave soldering)		Image
Bar & Solid Wire Solder	ALPHA SAC305 Excellent soldering performance High thermal fatigue resistance Widely used	Image
Bar & Solid Wire Solder	ALPHA SACX Plus 0807 Low Silver (0.8%) for improved value vs. SAC305 SAC305-like soldering and reliability performance on complex assemblies Low Copper dissolution and low drossing	Image
Liquid Flux	ALPHA EF-2100 ORL0 VOC free Passes SIR IPC J-STD-004B Wide process window	Image	Image	Image
Liquid Flux	ALPHA EF-6000 ORL0 Passes SIR IPC J-STD-004 High activity, rosin-free formula can be cleaned with DI water	Image
Liquid Flux	ALPHA EF-6808HF ROL0 Passes SIR IPC J-STD-004B Excellent for most standard complexity assemblies	Image	Image
Liquid Flux	ALPHA EF-8800HF ORL0 Passes SIR IPC J-STD-004B Designed for thick boards
Liquid Flux	Kester 951 ORL0 Passes SIR IPC J-STD-004 Rosin-free formula for clean post-soldering surface	Image	Image
Liquid Flux	Kester NF1060-VF ORM0 VOC free Passes SIR IPC J-STD-004B Exceptional wetting with excellent hole-fill
Liquid Flux	Kester 985M ORM0 Passes SIR IPC J-STD-004B Excellent solderability even on high density board
Liquid Flux	Kester NF372-TB ROL0 Passes SIR IPC J-STD-004B Sustained flux activity in challenging heating profile

Printing Dispensing & Jetting Gluing, Underfilling and Edgebonding Selectively Increasing Solder Volume - SMT

Reduced Voiding in Solder Joints

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