Servers

Computer servers connect workstations, PCs and many other communications devices to one another locally and via the internet. This equipment is generally complex and powerful in design and requires joining materials that are highly robust and can withstand the most challenging manufacturing environments yet meet high surface insulation resistance requirements.

Key Requirements for Joining Materials

Product options to enable flexibility in board design and manufacturing process
High electrochemical reliability alone and in combination with other joining materials
High thermal and electrical conductivity
High throughput, low defects

Product Type	Product Name	Low Temp	PB Free	Halogen Free
Solder Paste	ALPHA OM-363 SAC305 Repeatable printing down to 0.4mm/.016” pitch Low NWO and HIP Defects
Solder Paste	ALPHA OM-565 HRL3 Compatibility with HRL3 alloy for enhanced thermomechanical and drop shock reliability over existing low temperature solders HRL3 alloy enables peak reflow temperature of 175 °C to mitigate warpage induced defects Low melt point reflow reduces improves energy efficiency in assembly process Compatibility with contact rework applications
Solder Paste	ALPHA OM-550 HRL1 Compatability with HRL1 alloy for peak reflow temperature 190 °C Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Significant reduction in warpage-induced defects such as HIP and NWO
Solder Paste	ALPHA JP-500 SAC305 Jettable to 0.5mm/.020” pitch Excellent deposit consistency with high process capability index across all board designs Reduction in random solderballing levels, increasing first time yield
Solder Paste	ALPHA JP-501 SnBiAg Low HIP and NWO Defects Jettable to 0.5mm/.020” pitch
Solder Preforms	ALPHA BTC-578 Accuflux Preforms Innolot / SAC305 / Low-temp Increasing thermal conductivity and heat dissipation through void reduction Low flux residue improves electrochemical reliability Prevents mechanical stackup issues through increased solder volume
Solder Preforms	ALPHA TrueHeight Spacer Blocks Designed to deliver consistent bondline thickness (BLT) and minimize die tilt resulting in predictable reliability and performance designed into the device Provide precise height control up to +0.010mm Assure repeatable results with burr-free technology Easily integrate into standard SMT assembly using standard Tape and Reel Packaging
Solder Preforms	ALPHA Exactalloy Tape and Reel Preforms High solder volume precision and production yields using pick and place Available in many alloys, sizes and shapes
Cored Wire	ALPHA Telecore HF-850 SAC305 / SACX Plus 0307 Performs well with all standard pad finishes Can be used in both robotic and manual soldering processes ROL0
Cored Wire	Kester 268 SAC305/K100LD Optimzed for low spatter robotic soldering Can be used for manual and automated soldering processes Zero halogen ROL0
Bar & Solid Wire Solder	ALPHA SAC305 Excellent soldering performance High thermal fatigue resistance Widely used
Bar & Solid Wire Solder	ALPHA SACX Plus 0807 Low Silver (0.8%) for improved value vs. SAC305 SAC305-like soldering and reliability performance on complex assemblies Low Copper dissolution and low drossing
Bar & Solid Wire Solder	ALPHA HRL3 Low temperature enabling in selective and dip soldering processes Provides efficiencies in energy savings and reduces thermal damage Comparable hole fill performance and solder joint strength vs SAC305 Low Copper erosion vs SAC305
Liquid Flux	ALPHA EF-6808HF ROL0 Passes SIR IPC J-STD-004B Excellent for most standard complexity assemblies
Liquid Flux	ALPHA EF-8800HF ORL0 Passes SIR IPC J-STD-004B Designed for thick, complex boards
Liquid Flux	Kester NF372-TB ROL0 Passes SIR IPC J-STD-004B Sustained flux activity in challenging heating profile
Liquid Flux	Kester 985M ORM0 Passes SIR IPC J-STD-004B Excellent solderability even on high density board

Printing Dispensing & Jetting Gluing, Underfilling and Edgebonding Selectively Increasing Solder Volume - SMT

Reduced Voiding in Solder Joints

Key Requirements for Joining Materials

Product options to enable flexibility in board design and manufacturing process
High electrochemical reliability alone and in combination with other joining materials
High thermal and electrical conductivity
High throughput, low defects

Product Type	Product Name	Low Temp	PB Free	Halogen Free
Solder Paste	ALPHA OM-363 SAC305 Repeatable printing down to 0.4mm/.016” pitch Low NWO and HIP Defects
Solder Paste	ALPHA OM-565 HRL3 Compatibility with HRL3 alloy for enhanced thermomechanical and drop shock reliability over existing low temperature solders HRL3 alloy enables peak reflow temperature of 175 °C to mitigate warpage induced defects Low melt point reflow reduces improves energy efficiency in assembly process Compatibility with contact rework applications
Solder Paste	ALPHA OM-550 HRL1 Compatability with HRL1 alloy for peak reflow temperature 190 °C Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Significant reduction in warpage-induced defects such as HIP and NWO
Solder Paste	ALPHA JP-500 SAC305 Jettable to 0.5mm/.020” pitch Excellent deposit consistency with high process capability index across all board designs Reduction in random solderballing levels, increasing first time yield
Solder Paste	ALPHA JP-501 SnBiAg Low HIP and NWO Defects Jettable to 0.5mm/.020” pitch
Solder Preforms	ALPHA BTC-578 Accuflux Preforms Innolot / SAC305 / Low-temp Increasing thermal conductivity and heat dissipation through void reduction Low flux residue improves electrochemical reliability Prevents mechanical stackup issues through increased solder volume
Solder Preforms	ALPHA TrueHeight Spacer Blocks Designed to deliver consistent bondline thickness (BLT) and minimize die tilt resulting in predictable reliability and performance designed into the device Provide precise height control up to +0.010mm Assure repeatable results with burr-free technology Easily integrate into standard SMT assembly using standard Tape and Reel Packaging
Solder Preforms	ALPHA Exactalloy Tape and Reel Preforms High solder volume precision and production yields using pick and place Available in many alloys, sizes and shapes
Cored Wire	ALPHA Telecore HF-850 SAC305 / SACX Plus 0307 Performs well with all standard pad finishes Can be used in both robotic and manual soldering processes ROL0
Cored Wire	Kester 268 SAC305/K100LD Optimzed for low spatter robotic soldering Can be used for manual and automated soldering processes Zero halogen ROL0
Bar & Solid Wire Solder	ALPHA SAC305 Excellent soldering performance High thermal fatigue resistance Widely used
Bar & Solid Wire Solder	ALPHA SACX Plus 0807 Low Silver (0.8%) for improved value vs. SAC305 SAC305-like soldering and reliability performance on complex assemblies Low Copper dissolution and low drossing
Bar & Solid Wire Solder	ALPHA HRL3 Low temperature enabling in selective and dip soldering processes Provides efficiencies in energy savings and reduces thermal damage Comparable hole fill performance and solder joint strength vs SAC305 Low Copper erosion vs SAC305
Liquid Flux	ALPHA EF-6808HF ROL0 Passes SIR IPC J-STD-004B Excellent for most standard complexity assemblies
Liquid Flux	ALPHA EF-8800HF ORL0 Passes SIR IPC J-STD-004B Designed for thick, complex boards
Liquid Flux	Kester NF372-TB ROL0 Passes SIR IPC J-STD-004B Sustained flux activity in challenging heating profile
Liquid Flux	Kester 985M ORM0 Passes SIR IPC J-STD-004B Excellent solderability even on high density board

Printing Dispensing & Jetting Gluing, Underfilling and Edgebonding Selectively Increasing Solder Volume - SMT

Reduced Voiding in Solder Joints

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