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Consumer electronic devices are becoming more and more complex in our ever connected world. From Bluetooth to wired and wireless interfaces, or smart learning functionality to face, voice and fingerprint identification, even the most basic equipment is using some type of advanced technology.

Key Requirements for Joining Materials

High performance under wide process conditions
Excellent value, lowers total cost of ownership
High mechanical and electrochemical reliability

Product Type	Product Name	Low Temp	PB Free	Halogen Free	VOC Free
Solder Paste	ALPHA CVP-390V SAC305 / SACX Plus 0307 Wide reflow process window Fine feature printability down to 01005 feature size Broad latitude paste for ultimate flexibility in manufacturing Available in low silver SACX Plus alloy(s) for improved value
Solder Paste	ALPHA OM-353 SAC305 / SACX Plus 0307 Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Lowest post reflow residue spreads of Alpha’s chemistries Low HIP and NWO Defects Available in low silver SACX Plus alloy(s) for improved value
Solder Paste	ALPHA OM-565 HRL3 Compatibility with HRL3 alloy for enhanced thermomechanical and drop shock reliability over existing low temperature solders HRL3 alloy enables peak reflow temperature of 175 °C to mitigate warpage induced defects Low melt point reflow improves energy efficiency in assembly process Compatibility with contact rework applications
Solder Paste	ALPHA OM-550 HRL1 Compatability with HRL1 alloy for peak reflow temperature 190 °C Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Significant reduction in warpage-induced defects such as HIP and NWO
Solder Paste	ALPHA JP-500 SAC305 Jettable to 0.5mm/.020” pitch Excellent deposit consistency with high process capability index across all board designs Reduction in random solderballing levels, increasing first time yield
Solder Paste	ALPHA JP-501 SnBiAg Low HIP and NWO Defects Jettable to 0.5mm/.020” pitch
Solder Preforms	ALPHA BTC-578 Accuflux Preforms Innolot / SAC305 / Low-temp Increases thermal conductivity and heat dissipation through void reduction Low flux residue improves electrochemical reliability Prevents mechanical stack-up issues through increased solder volume
Solder Preforms	ALPHA Exactalloy Tape and Reel Preforms High solder volume precision and production yields using pick and place Available in many alloys, sizes and shapes
Cored Wire	ALPHA Telecore HF-850 SAC305 / SACX Plus 0307 Performs well with all standard pad finishes Can be used in both robotic and manual soldering processes ROL0
Cored Wire	ALPHA Telecore XL-825 SAC305 / SACX Plus 0307 Best for difficult to solder surfaces Can be used in both robotic and manual soldering processes ROL1
Cored Wire	Kester 268 SAC305/K100LD Optimzed for low spatter robotic soldering Can be used for manual and automated soldering processes Zero halogen ROL0
Cored Wire	Kester 285 SAC305 Highly active for soldering difficult surfaces while retaining ROL0 class Can be used for manual and automated soldering processes ROL0
Adhesive	ALPHA HiTech SM42-1311 SMD Adhesive Non-Sagging Excellent adhesion on FR4 Resists change due to high heat post application processing (i.e., wave soldering)
Adhesive	ALPHA HiTech SM42-120P SMD Adhesive Non-Sagging Excellent adhesion on FR4 Resists change due to high heat post application processing (i.e., wave soldering)
Bar & Solid Wire Solder	ALPHA SACX Plus 0307 Low Silver (0.3%) for improved value vs. SAC305 Low Copper dissolution and low drossing Excellent for most standard assemblies
Bar & Solid Wire Solder	ALPHA SnCX Plus 07 Silver free for best value of SnCu alloys Low Copper dissolution and low drossing
Bar & Solid Wire Solder	ALPHA HRL3 Low temperature enabling in selective and dip soldering processes Provides efficiencies in energy savings and reduces thermal damage Comparable hole fill performance and solder joint strength vs SAC305 Low Copper erosion vs SAC305
Liquid Flux	ALPHA EF-2100 ORL0 VOC free Passes SIR IPC J-STD-004B Wide process window
Liquid Flux	ALPHA EF-6000 ORL0 Passes SIR IPC J-STD-004 High activity, rosin-free formula can be cleaned with DI water
Liquid Flux	ALPHA EF-6103 ORL0 Passes SIR IPC J-STD-004B Best for selective soldering processes
Liquid Flux	ALPHA EF-9301 ROM1 Passes SIR IPC J-STD-004A Excellent for common boards
Liquid Flux	ALPHA SLS-65C ORL0 Passes SIR IPC J-STD-004 Low residue, moderate activity
Liquid Flux	Kester 951 ORL0 Passes SIR IPC J-STD-004 Rosin-free formula for clean post-soldering surface
Liquid Flux	Kester NF1060-VF ORM0 VOC free Passes SIR IPC J-STD-004B Exceptional wetting with excellent hole-fill
Liquid Flux	Kester 985M ORM0 Passes SIR IPC J-STD-004B Excellent solderability even on high density board

Printing Dispensing & Jetting Gluing, Underfilling and Edgebonding Selectively Increasing Solder Volume - SMT Manual Soldering and Rework - SMT

Key Requirements for Joining Materials

High performance under wide process conditions
Excellent value, lowers total cost of ownership
High mechanical and electrochemical reliability

Product Type	Product Name	Low Temp	PB Free	Halogen Free	VOC Free
Solder Paste	ALPHA CVP-390V SAC305 / SACX Plus 0307 Wide reflow process window Fine feature printability down to 01005 feature size Broad latitude paste for ultimate flexibility in manufacturing Available in low silver SACX Plus alloy(s) for improved value
Solder Paste	ALPHA OM-353 SAC305 / SACX Plus 0307 Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Lowest post reflow residue spreads of Alpha’s chemistries Low HIP and NWO Defects Available in low silver SACX Plus alloy(s) for improved value
Solder Paste	ALPHA OM-565 HRL3 Compatibility with HRL3 alloy for enhanced thermomechanical and drop shock reliability over existing low temperature solders HRL3 alloy enables peak reflow temperature of 175 °C to mitigate warpage induced defects Low melt point reflow improves energy efficiency in assembly process Compatibility with contact rework applications
Solder Paste	ALPHA OM-550 HRL1 Compatability with HRL1 alloy for peak reflow temperature 190 °C Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Significant reduction in warpage-induced defects such as HIP and NWO
Solder Paste	ALPHA JP-500 SAC305 Jettable to 0.5mm/.020” pitch Excellent deposit consistency with high process capability index across all board designs Reduction in random solderballing levels, increasing first time yield
Solder Paste	ALPHA JP-501 SnBiAg Low HIP and NWO Defects Jettable to 0.5mm/.020” pitch
Solder Preforms	ALPHA BTC-578 Accuflux Preforms Innolot / SAC305 / Low-temp Increases thermal conductivity and heat dissipation through void reduction Low flux residue improves electrochemical reliability Prevents mechanical stack-up issues through increased solder volume
Solder Preforms	ALPHA Exactalloy Tape and Reel Preforms High solder volume precision and production yields using pick and place Available in many alloys, sizes and shapes
Cored Wire	ALPHA Telecore HF-850 SAC305 / SACX Plus 0307 Performs well with all standard pad finishes Can be used in both robotic and manual soldering processes ROL0
Cored Wire	ALPHA Telecore XL-825 SAC305 / SACX Plus 0307 Best for difficult to solder surfaces Can be used in both robotic and manual soldering processes ROL1
Cored Wire	Kester 268 SAC305/K100LD Optimzed for low spatter robotic soldering Can be used for manual and automated soldering processes Zero halogen ROL0
Cored Wire	Kester 285 SAC305 Highly active for soldering difficult surfaces while retaining ROL0 class Can be used for manual and automated soldering processes ROL0
Adhesive	ALPHA HiTech SM42-1311 SMD Adhesive Non-Sagging Excellent adhesion on FR4 Resists change due to high heat post application processing (i.e., wave soldering)
Adhesive	ALPHA HiTech SM42-120P SMD Adhesive Non-Sagging Excellent adhesion on FR4 Resists change due to high heat post application processing (i.e., wave soldering)
Bar & Solid Wire Solder	ALPHA SACX Plus 0307 Low Silver (0.3%) for improved value vs. SAC305 Low Copper dissolution and low drossing Excellent for most standard assemblies
Bar & Solid Wire Solder	ALPHA SnCX Plus 07 Silver free for best value of SnCu alloys Low Copper dissolution and low drossing
Bar & Solid Wire Solder	ALPHA HRL3 Low temperature enabling in selective and dip soldering processes Provides efficiencies in energy savings and reduces thermal damage Comparable hole fill performance and solder joint strength vs SAC305 Low Copper erosion vs SAC305
Liquid Flux	ALPHA EF-2100 ORL0 VOC free Passes SIR IPC J-STD-004B Wide process window
Liquid Flux	ALPHA EF-6000 ORL0 Passes SIR IPC J-STD-004 High activity, rosin-free formula can be cleaned with DI water
Liquid Flux	ALPHA EF-6103 ORL0 Passes SIR IPC J-STD-004B Best for selective soldering processes
Liquid Flux	ALPHA EF-9301 ROM1 Passes SIR IPC J-STD-004A Excellent for common boards
Liquid Flux	ALPHA SLS-65C ORL0 Passes SIR IPC J-STD-004 Low residue, moderate activity
Liquid Flux	Kester 951 ORL0 Passes SIR IPC J-STD-004 Rosin-free formula for clean post-soldering surface
Liquid Flux	Kester NF1060-VF ORM0 VOC free Passes SIR IPC J-STD-004B Exceptional wetting with excellent hole-fill
Liquid Flux	Kester 985M ORM0 Passes SIR IPC J-STD-004B Excellent solderability even on high density board

Printing Dispensing & Jetting Gluing, Underfilling and Edgebonding Selectively Increasing Solder Volume - SMT Manual Soldering and Rework - SMT

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