High Voltage Industrial Electronics

High voltage industrial electronics can be dangerous if assembled or handled incorrectly. This equipment can be found in electrical power distribution, x-ray inspection, particle beam, arc ignition and other high power systems.

Key Requirements for Joining Materials

• Creep resistance
• Low voiding
• Electrochemical reliability
• Cleanable flux, Reduced rework
• Low warranty cost
• High mechanical strength
• Thermal management

Product Type	Product	Low Temp	PB Free	Halogen Free	VOC Free
Solder Paste	ALPHA OM-362 OM-362 is the next generation low-void solder paste product. Consistent distribution and void reduction can improve thermal dissipation generated from the die of your leading BTC package.
Solder Paste	ALPHA CVP-390 SAC305 / SACX Plus 0307 Wide reflow process window Fine feature printability down to 01005 feature size Broad latitude paste for ultimate flexibility in manufacturing Available in low silver SACX Plus alloy(s) for improved value
Solder Paste	ALPHA OM-353 SAC305 / SACX Plus 0307 Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Lowest post reflow residue spread of Alpha’s chemistries Low HIP and NWO Defects Available in low silver SACX Plus alloy(s) for improved value
Solder Paste	ALPHA JP-500 SAC305 Jettable to 0.5mm/.020” pitch Excellent deposit consistency with high process capability index across all board designs Reduction in random solderballing levels, increasing first time yield
Solder Paste	ALPHA JP-501 SnBiAg Low HIP and NWO Defects Jettable to 0.5mm/.020” pitch
Solder Preforms	ALPHA BTC-578 Accuflux Preforms Innolot / SAC305 / Low-temp Increase thermal conductivity and heat dissipation through void reduction Low flux residue improves electrochemical reliability Prevents mechanical stack-up issues through increased solder volume
Solder Preforms	ALPHA Exactalloy Industrial Solder Preforms Preforms that deliver precise fit, controlled solder volume and flux level consistency, and extensive alloy range for rugged industrial applications Available in standard shapes and sizes including discs, rectangles, washers, sleeves and wire segments Extensive list of lead and lead-free alloys Available with or without integrated flux coating or core
Solder Preforms	ALPHA Exactalloy Tape and Reel Preforms High solder volume precision and production yields using pick and place Available in many alloys, sizes and shapes
Cored Wire	ALPHA Telecore HF-850 SAC305 / SACX Plus 0307 Performs well with all standard pad finishes Can be used in both robotic and manual soldering processes ROL0
Cored Wire	ALPHA Telecore XL-825 SAC305 / SACX Plus 0307 Best for difficult to solder surfaces Can be used in both robotic and manual soldering processes ROL1
Cored Wire	Kester 268 SAC305/K100LD Optimzed for low spatter robotic soldering Can be used for manual and automated soldering processes Zero halogen ROL0
Cored Wire	Kester 285 SAC305 Highly active for soldering difficult surfaces while retaining ROL0 class Can be used for manual and automated soldering processes ROL0
Adhesive	ALPHA HiTech SM42-1311 SMD Adhesive Non-Sagging Excellent adhesion on FR4 Resists change due to high heat post application processing (i.e., wave soldering)
Adhesive	ALPHA HiTech SM42-120P SMD Adhesive Non-Sagging Excellent adhesion on FR4 Resists change due to high heat post application processing (i.e., wave soldering)
Bar & Solid Wire Solder	ALPHA SACX Plus 0307 Low Silver (0.3%) for improved value vs. SAC305 Low Copper dissolution and low drossing Excellent for most standard assemblies
Bar & Solid Wire Solder	ALPHA SnCX Plus 07 Silver free for best value of SnCu alloys Low Copper dissolution and low drossing
Bar & Solid Wire Solder	ALPHA HRL3 Low temperature enabling in selective and dip soldering processes Provides efficiencies in energy savings and reduces thermal damage Comparable hole fill performance and solder joint strength vs SAC305 Low Copper erosion vs SAC305
Liquid Flux	ALPHA EF-2100 ORL0 VOC free Passes SIR IPC J-STD-004B Wide process window
Liquid Flux	ALPHA EF-6000 ORL0 Passes SIR IPC J-STD-004 High activity, rosin-free formula can be cleaned with DI water
Liquid Flux	ALPHA EF-6103 ORL0 Passes SIR IPC J-STD-004B Best for selective soldering processes
Liquid Flux	ALPHA EF-9301 ROM1 Passes SIR IPC J-STD-004B Excellent for common boards
Liquid Flux	ALPHA SLS-65C ORL0 Passes IPC J-STD-004A Low residue, moderate activity
Liquid Flux	Kester 951 ORL0 Passes SIR IPC J-STD-004 Rosin-free formula for clean post-soldering surface
Liquid Flux	Kester NF1060-VF ORM0 VOC free Passes SIR IPC J-STD-004B Exceptional wetting with excellent hole-fill
Liquid Flux	Kester 985M ORM0 Passes SIR IPC J-STD-004B Excellent solderability even on high density board

Printing Gluing, Underfilling and Edgebonding Selectively Increasing Solder Volume - SMT Wave Soldering Selective Soldering

Key Requirements for Joining Materials

• Creep resistance
• Low voiding
• Electrochemical reliability
• Cleanable flux, Reduced rework
• Low warranty cost
• High mechanical strength
• Thermal management

Product Type	Product	Low Temp	PB Free	Halogen Free	VOC Free
Solder Paste	ALPHA OM-362 OM-362 is the next generation low-void solder paste product. Consistent distribution and void reduction can improve thermal dissipation generated from the die of your leading BTC package.
Solder Paste	ALPHA CVP-390 SAC305 / SACX Plus 0307 Wide reflow process window Fine feature printability down to 01005 feature size Broad latitude paste for ultimate flexibility in manufacturing Available in low silver SACX Plus alloy(s) for improved value
Solder Paste	ALPHA OM-353 SAC305 / SACX Plus 0307 Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Lowest post reflow residue spread of Alpha’s chemistries Low HIP and NWO Defects Available in low silver SACX Plus alloy(s) for improved value
Solder Paste	ALPHA JP-500 SAC305 Jettable to 0.5mm/.020” pitch Excellent deposit consistency with high process capability index across all board designs Reduction in random solderballing levels, increasing first time yield
Solder Paste	ALPHA JP-501 SnBiAg Low HIP and NWO Defects Jettable to 0.5mm/.020” pitch
Solder Preforms	ALPHA BTC-578 Accuflux Preforms Innolot / SAC305 / Low-temp Increase thermal conductivity and heat dissipation through void reduction Low flux residue improves electrochemical reliability Prevents mechanical stack-up issues through increased solder volume
Solder Preforms	ALPHA Exactalloy Industrial Solder Preforms Preforms that deliver precise fit, controlled solder volume and flux level consistency, and extensive alloy range for rugged industrial applications Available in standard shapes and sizes including discs, rectangles, washers, sleeves and wire segments Extensive list of lead and lead-free alloys Available with or without integrated flux coating or core
Solder Preforms	ALPHA Exactalloy Tape and Reel Preforms High solder volume precision and production yields using pick and place Available in many alloys, sizes and shapes
Cored Wire	ALPHA Telecore HF-850 SAC305 / SACX Plus 0307 Performs well with all standard pad finishes Can be used in both robotic and manual soldering processes ROL0
Cored Wire	ALPHA Telecore XL-825 SAC305 / SACX Plus 0307 Best for difficult to solder surfaces Can be used in both robotic and manual soldering processes ROL1
Cored Wire	Kester 268 SAC305/K100LD Optimzed for low spatter robotic soldering Can be used for manual and automated soldering processes Zero halogen ROL0
Cored Wire	Kester 285 SAC305 Highly active for soldering difficult surfaces while retaining ROL0 class Can be used for manual and automated soldering processes ROL0
Adhesive	ALPHA HiTech SM42-1311 SMD Adhesive Non-Sagging Excellent adhesion on FR4 Resists change due to high heat post application processing (i.e., wave soldering)
Adhesive	ALPHA HiTech SM42-120P SMD Adhesive Non-Sagging Excellent adhesion on FR4 Resists change due to high heat post application processing (i.e., wave soldering)
Bar & Solid Wire Solder	ALPHA SACX Plus 0307 Low Silver (0.3%) for improved value vs. SAC305 Low Copper dissolution and low drossing Excellent for most standard assemblies
Bar & Solid Wire Solder	ALPHA SnCX Plus 07 Silver free for best value of SnCu alloys Low Copper dissolution and low drossing
Bar & Solid Wire Solder	ALPHA HRL3 Low temperature enabling in selective and dip soldering processes Provides efficiencies in energy savings and reduces thermal damage Comparable hole fill performance and solder joint strength vs SAC305 Low Copper erosion vs SAC305
Liquid Flux	ALPHA EF-2100 ORL0 VOC free Passes SIR IPC J-STD-004B Wide process window
Liquid Flux	ALPHA EF-6000 ORL0 Passes SIR IPC J-STD-004 High activity, rosin-free formula can be cleaned with DI water
Liquid Flux	ALPHA EF-6103 ORL0 Passes SIR IPC J-STD-004B Best for selective soldering processes
Liquid Flux	ALPHA EF-9301 ROM1 Passes SIR IPC J-STD-004B Excellent for common boards
Liquid Flux	ALPHA SLS-65C ORL0 Passes IPC J-STD-004A Low residue, moderate activity
Liquid Flux	Kester 951 ORL0 Passes SIR IPC J-STD-004 Rosin-free formula for clean post-soldering surface
Liquid Flux	Kester NF1060-VF ORM0 VOC free Passes SIR IPC J-STD-004B Exceptional wetting with excellent hole-fill
Liquid Flux	Kester 985M ORM0 Passes SIR IPC J-STD-004B Excellent solderability even on high density board

Printing Gluing, Underfilling and Edgebonding Selectively Increasing Solder Volume - SMT Wave Soldering Selective Soldering

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High Voltage Industrial Electronics

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