In-Cabin

In-cabin electronics are becoming increasingly important to both control of the vehicle and comfort of its occupants. Electronic materials used in these devices require performance of a personal computer with increased reliability and optimization for total cost of ownership.

Recommended Solutions

Product Type	Product Name	Low Temp	PB Free	Halogen Free	VOC Free
Solder Paste	ALPHA CVP-390V SAC305 Excellent electrochemical reliability down to 0.100mm spacing Fine feature printability down to 01005 feature size Broad latitude paste for ultimate flexibility in manufacturing
Solder Paste	ALPHA OM-353 SAC305 / SACX Plus 0807 Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Lowest post reflow residue spread of Alpha’s chemistries Low HIP and NWO Defects Available in low silver SACX Plus alloy(s) for improved cost of ownership
Solder Paste	ALPHA OM-550 HRL1 Compatability with HRL1 alloy for peak reflow temperature 190°C Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Significant reduction in warpage-induced defects such as HIP and non-wet opens
Solder Paste	ALPHA OM-565 HRL3 Compatibility with HRL3 alloy for enhanced thermomechanical and drop shock reliability over existing low temperature solders HRL3 alloy enables peak reflow temperature of 175 °C to mitigate warpage induced defects Low melt point reflow reduces improves energy efficiecy in assembly process Compatibility with contact rework applications
Solder Preforms	ALPHA BTC-578 Accuflux Preforms Innolot / SAC305 / Low-temp Increasing thermal conductivity and heat dissipation through void reduction Low flux residue improves electrochemical reliability Prevents mechanical stackup issues through increased solder volume
Solder Preforms	ALPHA Tape and Reel Preforms High solder volume precision and production yields using pick and place Available in many alloys, sizes and shapes
Cored Wire	ALPHA Telecore HF-850 SAC305 / SACX Plus 0807 Performs well with all standard pad finishes Can be used in both robotic and manual soldering processes ROL0
Cored Wire	ALPHA Telecore XL-825 SAC305 / SACX Plus 0807 Best for difficult to solder surfaces Can be used in both robotic and manual soldering processes ROL1
Cored Wire	Kester 268 SAC305/K100LD Optimzed for low spatter robotic soldering Can be used for manual and automated soldering processes Zero halogen ROL0
Cored Wire	Kester 285 SAC305 Highly active for soldering difficult surfaces while retaining ROL0 class Can be used for manual and automated soldering processes ROL0
Underfill	ALPHA HiTech CU21-3240 Excellent High Thermal Shock Resistance
Edgebond	ALPHA HiTech CF31-4010 Excellent High Thermal Resistance
Adhesive	ALPHA HiTech SM42-1311 SMD Adhesive Non-Sagging Excellent adhesion on FR4 Resists change due to high heat post application processing (i.e., wave soldering)
Adhesive	ALPHA HiTech SM42-120P SMD Adhesive Non-Sagging Excellent adhesion on FR4 Resists change due to high heat post application processing (i.e., wave soldering)
Bar & Solid Wire Solder	ALPHA SAC305 Excellent soldering performance High thermal fatigue resistance Widely used
Bar & Solid Wire Solder	ALPHA SACX Plus 0807 Low Silver (0.8%) for improved value vs. SAC305 SAC305-like soldering and reliability performance on complex assemblies Low Copper dissolution and low drossing
Bar & Solid Wire Solder	ALPHA SACX Plus 0307 Low Silver (0.3%) for improved value vs. SAC305 Low Copper dissolution and low drossing Excellent for most standard assemblies
Liquid Flux	ALPHA EF-2100 ORL0 VOC free Passes SIR IPC J-STD-004B Wide process window
Liquid Flux	ALPHA EF-6000 ORL0 Passes SIR IPC J-STD-004 High activity, rosin-free formula can be cleaned with DI water
Liquid Flux	ALPHA EF-6808HF ROL0 Passes SIR IPC J-STD-004B Excellent for most standard complexity assemblies
Liquid Flux	Kester 951 ORL0 Passes SIR IPC J-STD-004 Rosin-free formula for clean post-soldering surface
Liquid Flux	Kester NF1060-VF ORM0 VOC free Passes SIR IPC J-STD-004B Exceptional wetting with excellent hole-fill
Liquid Flux	Kester NF372-TB ROL0 Passes SIR IPC J-STD-004B Sustained flux activity in challenging heating profile

Printing Dispensing & Jetting Gluing, Underfilling and Edgebonding Selectively Increasing Solder Volume - TH Selectively Increasing Solder Volume - SMT

Recommended Solutions

Product Type	Product Name	Low Temp	PB Free	Halogen Free	VOC Free
Solder Paste	ALPHA CVP-390V SAC305 Excellent electrochemical reliability down to 0.100mm spacing Fine feature printability down to 01005 feature size Broad latitude paste for ultimate flexibility in manufacturing
Solder Paste	ALPHA OM-353 SAC305 / SACX Plus 0807 Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Lowest post reflow residue spread of Alpha’s chemistries Low HIP and NWO Defects Available in low silver SACX Plus alloy(s) for improved cost of ownership
Solder Paste	ALPHA OM-550 HRL1 Compatability with HRL1 alloy for peak reflow temperature 190°C Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Significant reduction in warpage-induced defects such as HIP and non-wet opens
Solder Paste	ALPHA OM-565 HRL3 Compatibility with HRL3 alloy for enhanced thermomechanical and drop shock reliability over existing low temperature solders HRL3 alloy enables peak reflow temperature of 175 °C to mitigate warpage induced defects Low melt point reflow reduces improves energy efficiecy in assembly process Compatibility with contact rework applications
Solder Preforms	ALPHA BTC-578 Accuflux Preforms Innolot / SAC305 / Low-temp Increasing thermal conductivity and heat dissipation through void reduction Low flux residue improves electrochemical reliability Prevents mechanical stackup issues through increased solder volume
Solder Preforms	ALPHA Tape and Reel Preforms High solder volume precision and production yields using pick and place Available in many alloys, sizes and shapes
Cored Wire	ALPHA Telecore HF-850 SAC305 / SACX Plus 0807 Performs well with all standard pad finishes Can be used in both robotic and manual soldering processes ROL0
Cored Wire	ALPHA Telecore XL-825 SAC305 / SACX Plus 0807 Best for difficult to solder surfaces Can be used in both robotic and manual soldering processes ROL1
Cored Wire	Kester 268 SAC305/K100LD Optimzed for low spatter robotic soldering Can be used for manual and automated soldering processes Zero halogen ROL0
Cored Wire	Kester 285 SAC305 Highly active for soldering difficult surfaces while retaining ROL0 class Can be used for manual and automated soldering processes ROL0
Underfill	ALPHA HiTech CU21-3240 Excellent High Thermal Shock Resistance
Edgebond	ALPHA HiTech CF31-4010 Excellent High Thermal Resistance
Adhesive	ALPHA HiTech SM42-1311 SMD Adhesive Non-Sagging Excellent adhesion on FR4 Resists change due to high heat post application processing (i.e., wave soldering)
Adhesive	ALPHA HiTech SM42-120P SMD Adhesive Non-Sagging Excellent adhesion on FR4 Resists change due to high heat post application processing (i.e., wave soldering)
Bar & Solid Wire Solder	ALPHA SAC305 Excellent soldering performance High thermal fatigue resistance Widely used
Bar & Solid Wire Solder	ALPHA SACX Plus 0807 Low Silver (0.8%) for improved value vs. SAC305 SAC305-like soldering and reliability performance on complex assemblies Low Copper dissolution and low drossing
Bar & Solid Wire Solder	ALPHA SACX Plus 0307 Low Silver (0.3%) for improved value vs. SAC305 Low Copper dissolution and low drossing Excellent for most standard assemblies
Liquid Flux	ALPHA EF-2100 ORL0 VOC free Passes SIR IPC J-STD-004B Wide process window
Liquid Flux	ALPHA EF-6000 ORL0 Passes SIR IPC J-STD-004 High activity, rosin-free formula can be cleaned with DI water
Liquid Flux	ALPHA EF-6808HF ROL0 Passes SIR IPC J-STD-004B Excellent for most standard complexity assemblies
Liquid Flux	Kester 951 ORL0 Passes SIR IPC J-STD-004 Rosin-free formula for clean post-soldering surface
Liquid Flux	Kester NF1060-VF ORM0 VOC free Passes SIR IPC J-STD-004B Exceptional wetting with excellent hole-fill
Liquid Flux	Kester NF372-TB ROL0 Passes SIR IPC J-STD-004B Sustained flux activity in challenging heating profile

Printing Dispensing & Jetting Gluing, Underfilling and Edgebonding Selectively Increasing Solder Volume - TH Selectively Increasing Solder Volume - SMT

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In-Cabin

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