Network Infrastructure Servers, Routers, Switches, Antenna, Wireless Modems

Devices in this category support the high speed, uninterrupted transmission of an ever increasing amount of electronic communications data circulating globally and enabling the growth in the Internet of Things. This equipment is generally complex and powerful in design.

Key Requirements for Joining Materials

Product Type	Product Name	Low Temp	PB Free	Halogen Free	VOC Free
Solder Paste	ALPHA OM-353 SAC305 / SACX Plus 0307 Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Lowest post reflow residues of Alpha’s chemistries Low HIP and NWO Defects
Solder Paste	ALPHA OM-565 HRL3 Compatibility with HRL3 alloy for enhanced thermomechanical and drop shock reliability over existing low temperature solders HRL3 alloy enables peak reflow temperature of 175 °C to mitigate warpage induced defects Low melt point reflow improves energy efficiency in assembly process Compatibility with contact rework applications
Solder Paste	ALPHA OM-550 HRL1 Compatability with HRL1 alloy for peak reflow temperature 190 °C Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Significant reduction in warpage-induced defects such as HIP and NWO
Solder Paste	ALPHA JP-500 SAC305 Jettable to 0.5mm/.020” pitch Excellent deposit consistency with high process capability index across all board designs Reduction in random solderballing levels, increasing first time yield
Solder Paste	ALPHA JP-501 SnBiAg Low HIP and NWO Defects Jettable to 0.5mm/.020” pitch
Solder Preforms	ALPHA Exactalloy Tape and Reel Preforms High solder volume precision and production yields using pick and place Available in many alloys, sizes and shapes
Solder Preforms	ALPHA AccuFlux Solder Preforms - PCB Assembly An ideal solution for applications that require both low voiding in large area solder joints and a low flux residue solution appropriate for no clean manufacturing processes Various preform sizes and thicknesses available Fast placement using standard pick and place equipment Low-tack flux formulation
Solder Preforms	ALPHA Exactalloy Industrial Solder Preforms Preforms that deliver precise fit, controlled solder volume and flux level consistency, and extensive alloy range for rugged industrial applications Available in standard shapes and sizes including discs, rectangles, washers, sleeves and wire segments Extensive list of lead and lead-free alloys Available with or without integrated flux coating or core
Solder Preforms	ALPHA BTC-578 Accuflux Preforms SAC305 / Innolot / Low-temp Increasing thermal conductivity and dissipation through void reduction Low flux residue improves electrochemical reliability Prevents mechanical stackup issues through increased solder volume
Cored Wire	ALPHA Telecore HF-850 SAC305 Performs well with all standard pad finishes Can be used in both robotic and manual soldering processes ROL0
Cored Wire	ALPHA Telecore XL-825 SAC305 Best for difficult to solder surfaces Can be used in both robotic and manual soldering processes ROL1
Cored Wire	Kester 268 SAC305 Optimzed for low spatter robotic soldering Can be used for manual and automated soldering processes Zero halogen ROL0
Cored Wire	Kester 285 SAC305 Highly active for soldering difficult surfaces while retaining ROL0 class Can be used for manual and automated soldering processes ROL0
Bar & Solid Wire Solder	ALPHA SAC305 Excellent soldering performance High thermal fatigue resistance Widely used
Bar & Solid Wire Solder	ALPHA SACX Plus 0807 Low Silver (0.8%) for improved value vs. SAC305 SAC305-like soldering and reliability performance on complex assemblies Low Copper dissolution and low drossing
Bar & Solid Wire Solder	ALPHA SACX Plus 0307 Low Silver (0.3%) for improved value vs. SAC305 Low Copper dissolution and low drossing Excellent for most standard assemblies
Bar & Solid Wire Solder	ALPHA HRL3 Low temperature enabling in selective and dip soldering processes Provides efficiencies in energy savings and reduces thermal damage Comparable hole fill performance and solder joint strength vs SAC305 Low Copper erosion vs SAC305
Liquid Flux	ALPHA EF-2100 ORL0 VOC free Passes SIR IPC J-STD-004B Wide process window
Liquid Flux	ALPHA EF-6103 ORL0 Passes SIR IPC J-STD-004B Best for selective soldering processes
Liquid Flux	ALPHA EF-6808HF ROL0 Passes SIR IPC J-STD-004B Excellent for most standard complexity assemblies
Liquid Flux	ALPHA EF-8800HF ORL0 Passes SIR IPC J-STD-004B Designed for thick, complex boards
Liquid Flux	ALPHA SLS-65C ORL0 Passes SIR IPC J-STD-004 Low residue, moderate activity
Liquid Flux	Kester 951 ORL0 Passes SIR IPC J-STD-004 Rosin-free formula for clean post-soldering surface
Liquid Flux	Kester NF1060-VF ORM0 VOC free Passes SIR IPC J-STD-004B Exceptional wetting with excellent hole-fill
Liquid Flux	Kester 985M ORM0 Passes SIR IPC J-STD-004B Excellent solderability even on high density board
Liquid Flux	Kester NF372-TB ROL0 Passes SIR IPC J-STD-004B Sustained flux activity in challenging heating profile

Printing Dispensing & Jetting Gluing, Underfilling and Edgebonding Selectively Increasing Solder Volume - SMT Manual Soldering and Rework - SMT

Key Requirements for Joining Materials

Product Type	Product Name	Low Temp	PB Free	Halogen Free	VOC Free
Solder Paste	ALPHA OM-353 SAC305 / SACX Plus 0307 Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Lowest post reflow residues of Alpha’s chemistries Low HIP and NWO Defects
Solder Paste	ALPHA OM-565 HRL3 Compatibility with HRL3 alloy for enhanced thermomechanical and drop shock reliability over existing low temperature solders HRL3 alloy enables peak reflow temperature of 175 °C to mitigate warpage induced defects Low melt point reflow improves energy efficiency in assembly process Compatibility with contact rework applications
Solder Paste	ALPHA OM-550 HRL1 Compatability with HRL1 alloy for peak reflow temperature 190 °C Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Significant reduction in warpage-induced defects such as HIP and NWO
Solder Paste	ALPHA JP-500 SAC305 Jettable to 0.5mm/.020” pitch Excellent deposit consistency with high process capability index across all board designs Reduction in random solderballing levels, increasing first time yield
Solder Paste	ALPHA JP-501 SnBiAg Low HIP and NWO Defects Jettable to 0.5mm/.020” pitch
Solder Preforms	ALPHA Exactalloy Tape and Reel Preforms High solder volume precision and production yields using pick and place Available in many alloys, sizes and shapes
Solder Preforms	ALPHA AccuFlux Solder Preforms - PCB Assembly An ideal solution for applications that require both low voiding in large area solder joints and a low flux residue solution appropriate for no clean manufacturing processes Various preform sizes and thicknesses available Fast placement using standard pick and place equipment Low-tack flux formulation
Solder Preforms	ALPHA Exactalloy Industrial Solder Preforms Preforms that deliver precise fit, controlled solder volume and flux level consistency, and extensive alloy range for rugged industrial applications Available in standard shapes and sizes including discs, rectangles, washers, sleeves and wire segments Extensive list of lead and lead-free alloys Available with or without integrated flux coating or core
Solder Preforms	ALPHA BTC-578 Accuflux Preforms SAC305 / Innolot / Low-temp Increasing thermal conductivity and dissipation through void reduction Low flux residue improves electrochemical reliability Prevents mechanical stackup issues through increased solder volume
Cored Wire	ALPHA Telecore HF-850 SAC305 Performs well with all standard pad finishes Can be used in both robotic and manual soldering processes ROL0
Cored Wire	ALPHA Telecore XL-825 SAC305 Best for difficult to solder surfaces Can be used in both robotic and manual soldering processes ROL1
Cored Wire	Kester 268 SAC305 Optimzed for low spatter robotic soldering Can be used for manual and automated soldering processes Zero halogen ROL0
Cored Wire	Kester 285 SAC305 Highly active for soldering difficult surfaces while retaining ROL0 class Can be used for manual and automated soldering processes ROL0
Bar & Solid Wire Solder	ALPHA SAC305 Excellent soldering performance High thermal fatigue resistance Widely used
Bar & Solid Wire Solder	ALPHA SACX Plus 0807 Low Silver (0.8%) for improved value vs. SAC305 SAC305-like soldering and reliability performance on complex assemblies Low Copper dissolution and low drossing
Bar & Solid Wire Solder	ALPHA SACX Plus 0307 Low Silver (0.3%) for improved value vs. SAC305 Low Copper dissolution and low drossing Excellent for most standard assemblies
Bar & Solid Wire Solder	ALPHA HRL3 Low temperature enabling in selective and dip soldering processes Provides efficiencies in energy savings and reduces thermal damage Comparable hole fill performance and solder joint strength vs SAC305 Low Copper erosion vs SAC305
Liquid Flux	ALPHA EF-2100 ORL0 VOC free Passes SIR IPC J-STD-004B Wide process window
Liquid Flux	ALPHA EF-6103 ORL0 Passes SIR IPC J-STD-004B Best for selective soldering processes
Liquid Flux	ALPHA EF-6808HF ROL0 Passes SIR IPC J-STD-004B Excellent for most standard complexity assemblies
Liquid Flux	ALPHA EF-8800HF ORL0 Passes SIR IPC J-STD-004B Designed for thick, complex boards
Liquid Flux	ALPHA SLS-65C ORL0 Passes SIR IPC J-STD-004 Low residue, moderate activity
Liquid Flux	Kester 951 ORL0 Passes SIR IPC J-STD-004 Rosin-free formula for clean post-soldering surface
Liquid Flux	Kester NF1060-VF ORM0 VOC free Passes SIR IPC J-STD-004B Exceptional wetting with excellent hole-fill
Liquid Flux	Kester 985M ORM0 Passes SIR IPC J-STD-004B Excellent solderability even on high density board
Liquid Flux	Kester NF372-TB ROL0 Passes SIR IPC J-STD-004B Sustained flux activity in challenging heating profile

Printing Dispensing & Jetting Gluing, Underfilling and Edgebonding Selectively Increasing Solder Volume - SMT Manual Soldering and Rework - SMT

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Network Infrastructure Servers, Routers, Switches, Antenna, Wireless Modems

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