Industrial Controls

Industrial controls covers a broad range of electronics used to operate and monitor equipment and instruments used in manufacturing, transportation, automation, analytical and many other end use markets.

Key Requirements for Joining Materials

• Reduced total cost of ownership
• Fine feature printing
• Wide process window
• Low voiding
• Creep resistance
• Fast throughput

Product Type	Product	Low Temp	PB Free	Halogen Free	VOC Free
Solder Paste	ALPHA OM-362 OM-362 is the next generation low-void solder paste product. Consistent distribution and void reduction can improve thermal dissipation generated from the die of your leading BTC package.
Solder Paste	ALPHA CVP-390V SAC305 / SACX Excellent electrochemical reliability down to 0.100mm spacing Fine feature printability down to 01005 feature size Highest thermo-mechanical reliability at temperatures above 120°C (Innolot)
Solder Paste	ALPHA OM-353 SAC305 / SACX Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Lowest post reflow residue spread of Alpha’s chemistries Low HIP and NWO Defects Available in low silver SACX Plus alloy(s) for improved value
Solder Preforms	ALPHA BTC-578 Accuflux Preforms Innolot / SAC305 / Low-temp Increases thermal conductivity and heat dissipation through void reduction Low flux residue improves electrochemical reliability Prevents mechanical stack-up issues through increased solder volume
Solder Preforms	ALPHA Exactalloy Industrial Solder Preforms Preforms that deliver precise fit, controlled solder volume and flux level consistency, and extensive alloy range for rugged industrial applications Available in standard shapes and sizes including discs, rectangles, washers, sleeves and wire segments Extensive list of lead and lead-free alloys Available with or without integrated flux coating or core
Solder Preforms	ALPHA Exactalloy Tape and Reel Preforms High solder volume precision and production yields using pick and place Available in many alloys, sizes and shapes
Cored Wire	ALPHA Telecore HF-850 SAC305 / SACX Plus 0807 Performs well with all standard pad finishes Can be used in both robotic and manual soldering processes ROL0
Cored Wire	ALPHA Telecore XL-825 SAC305 / SACX Plus 0807 Best for difficult to solder surfaces Can be used in both robotic and manual soldering processes ROL1
Cored Wire	Kester 268 SAC305/K100LD Optimzed for low spatter robotic soldering Can be used for manual and automated soldering processes Zero halogen ROL0
Cored Wire	Kester 285 SAC305 Highly active for soldering difficult surfaces while retaining ROL0 class Can be used for manual and automated soldering processes ROL0
Adhesive	ALPHA HiTech SM42-1311 SMD Adhesive Non-Sagging Excellent adhesion on FR4 Resists change due to high heat post application processing (i.e., wave soldering)
Adhesive	ALPHA HiTech SM42-120P SMD Adhesive Non-Sagging Excellent adhesion on FR4 Resists change due to high heat post application processing (i.e., wave soldering)
Bar & Solid Wire Solder	ALPHA SAC305 Excellent soldering performance High thermal fatigue resistance Widely used
Bar & Solid Wire Solder	ALPHA SACX Plus 0807 Low Silver (0.8%) for improved value vs. SAC305 SAC305-like soldering and reliability performance on complex assemblies Low Copper dissolution and low drossing
Bar & Solid Wire Solder	ALPHA SACX Plus 0307 Low Silver (0.3%) for improved value vs. SAC305 Low Copper dissolution and low drossing Excellent for most standard assemblies
Bar & Solid Wire Solder	ALPHA HRL3 Low temperature enabling in selective and dip soldering processes Provides efficiencies in energy savings and reduces thermal damage Comparable hole fill performance and solder joint strength vs SAC305 Low Copper erosion vs SAC305
Liquid Flux	ALPHA EF-6103 ORL0 Passes SIR IPC J-STD-004B Best for selective soldering processes
Liquid Flux	ALPHA EF-6808HF ROL0 Passes SIR IPC J-STD-004B Excellent for most standard complexity assemblies
Liquid Flux	ALPHA EF-8000 ROL0 Passes SIR IPC J-STD-004B Designed for thick boards
Liquid Flux	Kester NF372-TB ROL0 Passes SIR IPC J-STD-004B Sustained flux activity in challenging heating profile

Printing Gluing, Underfilling and Edgebonding Selectively Increasing Solder Volume - SMT Wave Soldering Selective Soldering

Key Requirements for Joining Materials

• Reduced total cost of ownership
• Fine feature printing
• Wide process window
• Low voiding
• Creep resistance
• Fast throughput

Product Type	Product	Low Temp	PB Free	Halogen Free	VOC Free
Solder Paste	ALPHA OM-362 OM-362 is the next generation low-void solder paste product. Consistent distribution and void reduction can improve thermal dissipation generated from the die of your leading BTC package.
Solder Paste	ALPHA CVP-390V SAC305 / SACX Excellent electrochemical reliability down to 0.100mm spacing Fine feature printability down to 01005 feature size Highest thermo-mechanical reliability at temperatures above 120°C (Innolot)
Solder Paste	ALPHA OM-353 SAC305 / SACX Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Lowest post reflow residue spread of Alpha’s chemistries Low HIP and NWO Defects Available in low silver SACX Plus alloy(s) for improved value
Solder Preforms	ALPHA BTC-578 Accuflux Preforms Innolot / SAC305 / Low-temp Increases thermal conductivity and heat dissipation through void reduction Low flux residue improves electrochemical reliability Prevents mechanical stack-up issues through increased solder volume
Solder Preforms	ALPHA Exactalloy Industrial Solder Preforms Preforms that deliver precise fit, controlled solder volume and flux level consistency, and extensive alloy range for rugged industrial applications Available in standard shapes and sizes including discs, rectangles, washers, sleeves and wire segments Extensive list of lead and lead-free alloys Available with or without integrated flux coating or core
Solder Preforms	ALPHA Exactalloy Tape and Reel Preforms High solder volume precision and production yields using pick and place Available in many alloys, sizes and shapes
Cored Wire	ALPHA Telecore HF-850 SAC305 / SACX Plus 0807 Performs well with all standard pad finishes Can be used in both robotic and manual soldering processes ROL0
Cored Wire	ALPHA Telecore XL-825 SAC305 / SACX Plus 0807 Best for difficult to solder surfaces Can be used in both robotic and manual soldering processes ROL1
Cored Wire	Kester 268 SAC305/K100LD Optimzed for low spatter robotic soldering Can be used for manual and automated soldering processes Zero halogen ROL0
Cored Wire	Kester 285 SAC305 Highly active for soldering difficult surfaces while retaining ROL0 class Can be used for manual and automated soldering processes ROL0
Adhesive	ALPHA HiTech SM42-1311 SMD Adhesive Non-Sagging Excellent adhesion on FR4 Resists change due to high heat post application processing (i.e., wave soldering)
Adhesive	ALPHA HiTech SM42-120P SMD Adhesive Non-Sagging Excellent adhesion on FR4 Resists change due to high heat post application processing (i.e., wave soldering)
Bar & Solid Wire Solder	ALPHA SAC305 Excellent soldering performance High thermal fatigue resistance Widely used
Bar & Solid Wire Solder	ALPHA SACX Plus 0807 Low Silver (0.8%) for improved value vs. SAC305 SAC305-like soldering and reliability performance on complex assemblies Low Copper dissolution and low drossing
Bar & Solid Wire Solder	ALPHA SACX Plus 0307 Low Silver (0.3%) for improved value vs. SAC305 Low Copper dissolution and low drossing Excellent for most standard assemblies
Bar & Solid Wire Solder	ALPHA HRL3 Low temperature enabling in selective and dip soldering processes Provides efficiencies in energy savings and reduces thermal damage Comparable hole fill performance and solder joint strength vs SAC305 Low Copper erosion vs SAC305
Liquid Flux	ALPHA EF-6103 ORL0 Passes SIR IPC J-STD-004B Best for selective soldering processes
Liquid Flux	ALPHA EF-6808HF ROL0 Passes SIR IPC J-STD-004B Excellent for most standard complexity assemblies
Liquid Flux	ALPHA EF-8000 ROL0 Passes SIR IPC J-STD-004B Designed for thick boards
Liquid Flux	Kester NF372-TB ROL0 Passes SIR IPC J-STD-004B Sustained flux activity in challenging heating profile

Printing Gluing, Underfilling and Edgebonding Selectively Increasing Solder Volume - SMT Wave Soldering Selective Soldering

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