Ruggedized Industrial Electronics

Ruggedized industrial electronics must be resistant to a high degree of mechanical stress including vibration, drop shock and exposure to a broad range of temperatures and moisture. These assemblies are commonly used in field applications including sub-surface, construction, monitoring and adventure sporting equipment.

Key Requirements for Joining Materials

• High operating temperature
• Creep resistance
• High electrical & mechanical reliability
• Low voiding
• Reduced rework
• Thermal management
• Pin testable

Product Type	Product	Low Temp	PB Free	Halogen Free	VOC Free
Solder Paste	ALPHA OM-362 OM-362 is the next generation low-void solder paste product. Consistent distribution and void reduction can improve thermal dissipation generated from the die of your leading BTC package.
Solder Paste	ALPHA CVP-390V Innolot Excellent electrochemical reliability down to 0.100mm spacing Fine feature printability down to 01005 feature size Highest thermo-mechanical reliability at temperatures above 120°C (Innolot)
Solder Paste	ALPHA OM-353 Innolot Lowest post reflow residue spread of Alpha’s chemistries Excellent electrochemical reliability down to 0.200mm spacing Low HIP and NWO Defects Highest thermo-mechanical reliability at temperatures above 120°C (Innolot)
Solder Paste	ALPHA WS-826 SAC305 Best mechanical performance of Alpha’s low temperature solder alloys Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Significant reduction in warpage-induced defects such as HIP and NWO
Solder Preforms	ALPHA BTC-578 Accuflux Preforms Innolot / SAC305 / Low-temp Increases thermal conductivity and heat dissipation through void reduction Low flux residue improves electrochemical reliability Prevents mechanical stack-up issues through increased solder volume
Solder Preforms	ALPHA Exactalloy Industrial Solder Preforms Preforms that deliver precise fit, controlled solder volume and flux level consistency, and extensive alloy range for rugged industrial applications Available in standard shapes and sizes including discs, rectangles, washers, sleeves and wire segments Extensive list of lead and lead-free alloys Available with or without integrated flux coating or core
Solder Preforms	ALPHA Exactalloy Tape and Reel Preforms High solder volume precision and production yields using pick and place Available in many alloys, sizes and shapes
Cored Wire	ALPHA Telecore HF-850 SAC305 Performs well with all standard pad finishes Can be used in both robotic and manual soldering processes ROL0
Cored Wire	ALPHA Telecore XL-825 SAC305 Best for difficult to solder surfaces Can be used in both robotic and manual soldering processes ROL1
Cored Wire	Kester 268 SAC305 Optimzed for low spatter robotic soldering Can be used for manual and automated soldering processes Zero halogen ROL0
Cored Wire	Kester 285 SAC305 Highly active for soldering difficult surfaces while retaining ROL0 class Can be used for manual and automated soldering processes ROL0
Adhesive	ALPHA HiTech SM42-1311 SMD Adhesive Non-Sagging Excellent adhesion on FR4 Resists change due to high heat post application processing (i.e., wave soldering)
Adhesive	ALPHA HiTech SM42-120P SMD Adhesive Non-Sagging Excellent adhesion on FR4 Resists change due to high heat post application processing (i.e., wave soldering)
Bar & Solid Wire Solder	ALPHA SAC305 Excellent soldering performance High thermal fatigue resistance Widely used
Bar & Solid Wire Solder	ALPHA SACX Plus 0807 Low Silver (0.8%) for improved value vs. SAC305 SAC305-like soldering and reliability performance on complex assemblies Low Copper dissolution and low drossing
Liquid Flux	ALPHA EF-2100 ORL0 VOC free Passes SIR IPC J-STD-004B Wide process window
Liquid Flux	ALPHA EF-6000 ORL0 Passes SIR IPC J-STD-004 High activity, rosin-free formula can be cleaned with DI water
Liquid Flux	ALPHA EF-6103 ORL0 Passes SIR IPC J-STD-004B Best for selective soldering processes
Liquid Flux	ALPHA EF-6808HF ROL0 Passes SIR IPC J-STD-004B Excellent for most standard complexity assemblies
Liquid Flux	ALPHA EF-8800HF ORL0 Passes SIR IPC J-STD-004B Designed for thick, complex boards
Liquid Flux	Kester 951 ORL0 Passes SIR IPC J-STD-004 Rosin-free formula for clean post-soldering surface
Liquid Flux	Kester NF1060-VF ORM0 VOC free Passes SIR IPC J-STD-004B Exceptional wetting with excellent hole-fill
Liquid Flux	Kester NF372-TB ROL0 Passes SIR IPC J-STD-004B Sustained flux activity in challenging heating profile

Printing Gluing, Underfilling and Edgebonding Selectively Increasing Solder Volume - SMT Wave Soldering Selective Soldering

Key Requirements for Joining Materials

• High operating temperature
• Creep resistance
• High electrical & mechanical reliability
• Low voiding
• Reduced rework
• Thermal management
• Pin testable

Product Type	Product	Low Temp	PB Free	Halogen Free	VOC Free
Solder Paste	ALPHA OM-362 OM-362 is the next generation low-void solder paste product. Consistent distribution and void reduction can improve thermal dissipation generated from the die of your leading BTC package.
Solder Paste	ALPHA CVP-390V Innolot Excellent electrochemical reliability down to 0.100mm spacing Fine feature printability down to 01005 feature size Highest thermo-mechanical reliability at temperatures above 120°C (Innolot)
Solder Paste	ALPHA OM-353 Innolot Lowest post reflow residue spread of Alpha’s chemistries Excellent electrochemical reliability down to 0.200mm spacing Low HIP and NWO Defects Highest thermo-mechanical reliability at temperatures above 120°C (Innolot)
Solder Paste	ALPHA WS-826 SAC305 Best mechanical performance of Alpha’s low temperature solder alloys Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Significant reduction in warpage-induced defects such as HIP and NWO
Solder Preforms	ALPHA BTC-578 Accuflux Preforms Innolot / SAC305 / Low-temp Increases thermal conductivity and heat dissipation through void reduction Low flux residue improves electrochemical reliability Prevents mechanical stack-up issues through increased solder volume
Solder Preforms	ALPHA Exactalloy Industrial Solder Preforms Preforms that deliver precise fit, controlled solder volume and flux level consistency, and extensive alloy range for rugged industrial applications Available in standard shapes and sizes including discs, rectangles, washers, sleeves and wire segments Extensive list of lead and lead-free alloys Available with or without integrated flux coating or core
Solder Preforms	ALPHA Exactalloy Tape and Reel Preforms High solder volume precision and production yields using pick and place Available in many alloys, sizes and shapes
Cored Wire	ALPHA Telecore HF-850 SAC305 Performs well with all standard pad finishes Can be used in both robotic and manual soldering processes ROL0
Cored Wire	ALPHA Telecore XL-825 SAC305 Best for difficult to solder surfaces Can be used in both robotic and manual soldering processes ROL1
Cored Wire	Kester 268 SAC305 Optimzed for low spatter robotic soldering Can be used for manual and automated soldering processes Zero halogen ROL0
Cored Wire	Kester 285 SAC305 Highly active for soldering difficult surfaces while retaining ROL0 class Can be used for manual and automated soldering processes ROL0
Adhesive	ALPHA HiTech SM42-1311 SMD Adhesive Non-Sagging Excellent adhesion on FR4 Resists change due to high heat post application processing (i.e., wave soldering)
Adhesive	ALPHA HiTech SM42-120P SMD Adhesive Non-Sagging Excellent adhesion on FR4 Resists change due to high heat post application processing (i.e., wave soldering)
Bar & Solid Wire Solder	ALPHA SAC305 Excellent soldering performance High thermal fatigue resistance Widely used
Bar & Solid Wire Solder	ALPHA SACX Plus 0807 Low Silver (0.8%) for improved value vs. SAC305 SAC305-like soldering and reliability performance on complex assemblies Low Copper dissolution and low drossing
Liquid Flux	ALPHA EF-2100 ORL0 VOC free Passes SIR IPC J-STD-004B Wide process window
Liquid Flux	ALPHA EF-6000 ORL0 Passes SIR IPC J-STD-004 High activity, rosin-free formula can be cleaned with DI water
Liquid Flux	ALPHA EF-6103 ORL0 Passes SIR IPC J-STD-004B Best for selective soldering processes
Liquid Flux	ALPHA EF-6808HF ROL0 Passes SIR IPC J-STD-004B Excellent for most standard complexity assemblies
Liquid Flux	ALPHA EF-8800HF ORL0 Passes SIR IPC J-STD-004B Designed for thick, complex boards
Liquid Flux	Kester 951 ORL0 Passes SIR IPC J-STD-004 Rosin-free formula for clean post-soldering surface
Liquid Flux	Kester NF1060-VF ORM0 VOC free Passes SIR IPC J-STD-004B Exceptional wetting with excellent hole-fill
Liquid Flux	Kester NF372-TB ROL0 Passes SIR IPC J-STD-004B Sustained flux activity in challenging heating profile

Printing Gluing, Underfilling and Edgebonding Selectively Increasing Solder Volume - SMT Wave Soldering Selective Soldering

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Ruggedized Industrial Electronics

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