Medical

The medical industry is evolving with increased implementation of in-home devices as well as high power medical imaging devices at hospitals where on-demand performance and reliability is non-negotiable. Assemblies require better thermal heat dissipation, minimal flux residue, and enhanced electrical reliability.

Key Requirements for Joining Materials

• Creep resistance
• Low voiding
• Electrochemical reliability
• Cleanable flux, reduced rework
• Low warranty cost
• High mechanical strength
• Thermal management

Product Type	Product	Low Temp	PB Free	Halogen Free	VOC Free
Solder Paste	ALPHA OM-362 Ultra-Low Voiding Performance - Increases process stability, thermal, and electrical performance of the most demanding component applications. Excellent Electromigration migration characteristics on large BTC Passes IPC J-STD-004C IPC-TM-650 at 100 μm to ensure electrical reliability & functionality of fine-pitched components.
Solder Paste	ALPHA CVP-390 Innolot / SAC305 Excellent electrochemical reliability down to 0.100mm spacing Fine feature printability down to 01005 feature size Highest thermo-mechanical reliability at temperatures above 120°C (Innolot)
Solder Paste	ALPHA OM-353 Innolot / SAC305 Lowest post reflow residue spread of Alpha’s chemistries Excellent electrochemical reliability down to 0.200mm spacing Low HIP and NWO Defects Highest thermo-mechanical reliability at temperatures above 120°C (Innolot)
Solder Paste	ALPHA OM-565 HRL3 Compatibility with HRL3 alloy for enhanced thermomechanical and drop shock reliability over existing low temperature solders HRL3 alloy enables peak reflow temperature of 175 °C to mitigate warpage induced defects low melt point reflow reduces improves energy efficiecy in assembly process Compatibility with contact rework applications
Solder Paste	ALPHA OM-550 HRL1 Compatability with HRL1 alloy for peak reflow temperature 190 °C Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Significant reduction in warpage-induced defects such as HIP and NWO
Solder Paste	ALPHA JP-500 SAC305 Jettable to 0.5mm/.020” pitch Excellent deposit consistency with high process capability index across all board designs Reduction in random solderballing levels, increasing first time yield
Solder Paste	ALPHA WS-820 Low HIP and NWO Defects Jettable to 0.5mm/.020” pitch
Solder Preforms	ALPHA BTC-578 Accuflux Preforms Innolot / SAC305 / Low-temp Increase thermal conductivity and heat dissipation through void reduction Low flux residue improves electrochemical reliability Prevents mechanical stack-up issues through increased solder volume
Solder Preforms	ALPHA Exactalloy Industrial Solder Preforms Preforms that deliver precise fit, controlled solder volume and flux level consistency, and extensive alloy range for rugged industrial applications Available in standard shapes and sizes including discs, rectangles, washers, sleeves and wire segments Extensive list of lead and lead-free alloys Available with or without integrated flux coating or core
Solder Preforms	ALPHA Exactalloy Tape and Reel Preforms High solder volume precision and production yields using pick and place Available in many alloys, sizes and shapes
Cored Wire	ALPHA Telecore HF-850 SAC305 / SACX Plus 0307 Performs well with all standard pad finishes Can be used in both robotic and manual soldering processes ROL0
Cored Wire	ALPHA Telecore XL-825 SAC305 / SACX Plus 0307 Best for difficult to solder surfaces Can be used in both robotic and manual soldering processes ROL1
Cored Wire	Kester 285 SAC305 Highly active for soldering difficult surfaces while retaining ROL0 class Can be used for manual and automated soldering processes ROL0
Underfill	ALPHA HiTech CU21-3240 Excellent High Thermal Shock Resistance
Edgebond	ALPHA HiTech CF31-4010 Excellent High Thermal Resistance
Adhesive	ALPHA HiTech SM42-1311 SMD Adhesive Non-Sagging Excellent adhesion on FR4 Resists change due to high heat post application processing (i.e., wave soldering)
Adhesive	ALPHA HiTech SM42-120P SMD Adhesive Non-Sagging Excellent adhesion on FR4 Resists change due to high heat post application processing (i.e., wave soldering)
Bar & Solid Wire Solder	ALPHA SAC305 Excellent soldering performance High thermal fatigue resistance Widely used
Bar & Solid Wire Solder	ALPHA SACX Plus 0807 Low Silver (0.8%) for improved value vs. SAC305 SAC305-like soldering and reliability performance on complex assemblies Low Copper dissolution and low drossing
Bar & Solid Wire Solder	ALPHA HRL3 Low temperature enabling in selective and dip soldering processes Provides efficiencies in energy savings and reduces thermal damage Comparable hole fill performance and solder joint strength vs SAC305 Low Copper erosion vs SAC305
Liquid Flux	ALPHA EF-2100 ORL0 VOC free Passes SIR IPC J-STD-004B Wide process window
Liquid Flux	ALPHA EF-6000 ORL0 Passes SIR IPC J-STD-004 High activity, rosin-free formula can be cleaned with DI water
Liquid Flux	ALPHA EF-6103 ORL0 Passes SIR IPC J-STD-004B Best for selective soldering processes
Liquid Flux	ALPHA EF-6808HF ROL0 Passes SIR IPC J-STD-004B Excellent for most standard complexity assemblies
Liquid Flux	ALPHA SLS-65C ORL0 Passes SIR IPC J-STD-004 Low residue, moderate activity
Liquid Flux	Kester 951 ORL0 Passes SIR IPC J-STD-004 Rosin-free formula for clean post-soldering surface
Liquid Flux	Kester NF1060-VF ORM0 VOC free Passes SIR IPC J-STD-004B Exceptional wetting with excellent hole-fill
Liquid Flux	Kester NF372-TB ROL0 Passes SIR IPC J-STD-004B Sustained flux activity in challenging heating profile

Printing Gluing, Underfilling and Edgebonding Selectively Increasing Solder Volume - SMT Wave Soldering Selective Soldering

Key Requirements for Joining Materials

• Creep resistance
• Low voiding
• Electrochemical reliability
• Cleanable flux, reduced rework
• Low warranty cost
• High mechanical strength
• Thermal management

Product Type	Product	Low Temp	PB Free	Halogen Free	VOC Free
Solder Paste	ALPHA OM-362 Ultra-Low Voiding Performance - Increases process stability, thermal, and electrical performance of the most demanding component applications. Excellent Electromigration migration characteristics on large BTC Passes IPC J-STD-004C IPC-TM-650 at 100 μm to ensure electrical reliability & functionality of fine-pitched components.
Solder Paste	ALPHA CVP-390 Innolot / SAC305 Excellent electrochemical reliability down to 0.100mm spacing Fine feature printability down to 01005 feature size Highest thermo-mechanical reliability at temperatures above 120°C (Innolot)
Solder Paste	ALPHA OM-353 Innolot / SAC305 Lowest post reflow residue spread of Alpha’s chemistries Excellent electrochemical reliability down to 0.200mm spacing Low HIP and NWO Defects Highest thermo-mechanical reliability at temperatures above 120°C (Innolot)
Solder Paste	ALPHA OM-565 HRL3 Compatibility with HRL3 alloy for enhanced thermomechanical and drop shock reliability over existing low temperature solders HRL3 alloy enables peak reflow temperature of 175 °C to mitigate warpage induced defects low melt point reflow reduces improves energy efficiecy in assembly process Compatibility with contact rework applications
Solder Paste	ALPHA OM-550 HRL1 Compatability with HRL1 alloy for peak reflow temperature 190 °C Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Significant reduction in warpage-induced defects such as HIP and NWO
Solder Paste	ALPHA JP-500 SAC305 Jettable to 0.5mm/.020” pitch Excellent deposit consistency with high process capability index across all board designs Reduction in random solderballing levels, increasing first time yield
Solder Paste	ALPHA WS-820 Low HIP and NWO Defects Jettable to 0.5mm/.020” pitch
Solder Preforms	ALPHA BTC-578 Accuflux Preforms Innolot / SAC305 / Low-temp Increase thermal conductivity and heat dissipation through void reduction Low flux residue improves electrochemical reliability Prevents mechanical stack-up issues through increased solder volume
Solder Preforms	ALPHA Exactalloy Industrial Solder Preforms Preforms that deliver precise fit, controlled solder volume and flux level consistency, and extensive alloy range for rugged industrial applications Available in standard shapes and sizes including discs, rectangles, washers, sleeves and wire segments Extensive list of lead and lead-free alloys Available with or without integrated flux coating or core
Solder Preforms	ALPHA Exactalloy Tape and Reel Preforms High solder volume precision and production yields using pick and place Available in many alloys, sizes and shapes
Cored Wire	ALPHA Telecore HF-850 SAC305 / SACX Plus 0307 Performs well with all standard pad finishes Can be used in both robotic and manual soldering processes ROL0
Cored Wire	ALPHA Telecore XL-825 SAC305 / SACX Plus 0307 Best for difficult to solder surfaces Can be used in both robotic and manual soldering processes ROL1
Cored Wire	Kester 285 SAC305 Highly active for soldering difficult surfaces while retaining ROL0 class Can be used for manual and automated soldering processes ROL0
Underfill	ALPHA HiTech CU21-3240 Excellent High Thermal Shock Resistance
Edgebond	ALPHA HiTech CF31-4010 Excellent High Thermal Resistance
Adhesive	ALPHA HiTech SM42-1311 SMD Adhesive Non-Sagging Excellent adhesion on FR4 Resists change due to high heat post application processing (i.e., wave soldering)
Adhesive	ALPHA HiTech SM42-120P SMD Adhesive Non-Sagging Excellent adhesion on FR4 Resists change due to high heat post application processing (i.e., wave soldering)
Bar & Solid Wire Solder	ALPHA SAC305 Excellent soldering performance High thermal fatigue resistance Widely used
Bar & Solid Wire Solder	ALPHA SACX Plus 0807 Low Silver (0.8%) for improved value vs. SAC305 SAC305-like soldering and reliability performance on complex assemblies Low Copper dissolution and low drossing
Bar & Solid Wire Solder	ALPHA HRL3 Low temperature enabling in selective and dip soldering processes Provides efficiencies in energy savings and reduces thermal damage Comparable hole fill performance and solder joint strength vs SAC305 Low Copper erosion vs SAC305
Liquid Flux	ALPHA EF-2100 ORL0 VOC free Passes SIR IPC J-STD-004B Wide process window
Liquid Flux	ALPHA EF-6000 ORL0 Passes SIR IPC J-STD-004 High activity, rosin-free formula can be cleaned with DI water
Liquid Flux	ALPHA EF-6103 ORL0 Passes SIR IPC J-STD-004B Best for selective soldering processes
Liquid Flux	ALPHA EF-6808HF ROL0 Passes SIR IPC J-STD-004B Excellent for most standard complexity assemblies
Liquid Flux	ALPHA SLS-65C ORL0 Passes SIR IPC J-STD-004 Low residue, moderate activity
Liquid Flux	Kester 951 ORL0 Passes SIR IPC J-STD-004 Rosin-free formula for clean post-soldering surface
Liquid Flux	Kester NF1060-VF ORM0 VOC free Passes SIR IPC J-STD-004B Exceptional wetting with excellent hole-fill
Liquid Flux	Kester NF372-TB ROL0 Passes SIR IPC J-STD-004B Sustained flux activity in challenging heating profile

Printing Gluing, Underfilling and Edgebonding Selectively Increasing Solder Volume - SMT Wave Soldering Selective Soldering

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