Consumer Electronics

We provide a full range of fabrication and assembly materials, including low-temperature solder alloys, designed to maximize throughput and minimize total cost of ownership.

Boost Throughput with Low-Cost, Low-Temp Solder Solutions

For consumer electronics Printed Circuit Board (PCB) assembly and semiconductor manufacturing, our integrated solutions, expertise, and innovative processes enable designers to miniaturize components, enhance performance, and reduce the total cost of ownership.

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Consumer Electronics Segments

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Devices

Engineered for scratch resistance, chemical durability, and long‑life performance, our hardcoated films support high‑use devices in home, personal, and smart‑tech applications. 

Electronic Display Screens

Hardcoated films provide durable, high‑clarity, tactile surface films that enhance touch interfaces, displays, labels, and control panels in consumer electronics.   

Wearables

We offer interconnect and protective materials for System-in-Package (SiP) and Wafer-Level Packaging (WLP) innovation, enhancing durability, miniaturization, and reliability, as well as thermal and drop-shock performance. 

Our unique product line of flexible, formable, and stretchable inks is ideal for wearable electronics applications.

White Goods

By optimizing PCB assembly, our connection and reinforcing materials achieve higher yields, reduce manufacturing costs, and improve component reliability.  

Designed for demanding household environments, our hardcoated films deliver decorative, long-lasting surfaces for appliance control panels and fascias, resisting scratches, chemicals, and daily wear. 

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Circuit Board Assembly

Driving PCB technology with leading-edge electronic materials for high-reliability in complex Circuit Board Assemblies (CBAs).

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Circuitry Solutions

Enabling next-gen technology with innovative specialty chemistries and materials for the most complex PCB and IC substrate designs.

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Film & Smart Surface Solutions

Functional Films & Smart Surfaces for Seamless Interfaces.  

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Semiconductor Assembly

Advancing innovative electronics with reliable bondline materials for electronics, photomasks, die attach, packaging and camera modules.

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Wafer Level Packaging

Maximizing reliability and performance of computer chips with leading-edge wafer level packaging for innovative semiconductor design.

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Why MacDermid Alpha?

Integrated Solutions
Our materials' compatibility improves electronics reliability.

Sustainability
Bio-based protection solutions made from regenerative raw materials.

Reliability
Integrated materials designed to connect, interconnect, and protect.

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