Our trusted immersion tin final finishes deliver consistent reliability and unrivaled productivity.
Our immersion tin plating solutions provide exceptional performance by reducing copper-tin diffusion, inhibiting whisker formation, and ensuring superior solderability in lead-free assembly reflows.
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Secure strong solder joints, touchpad functionality, and aluminum wire bonding with the industry's most trusted ImAg finishes.
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Our deep understanding of the interaction between final finishes and circuit board assembly materials allows us to deliver the highest reliability solutions.
Sustainability
With longer bath life, reduced precious metal content, lower operating temperatures, and dummy-free chemistry, we offer significant ESG benefits for fabricators and OEMs.
Reliability
We apply Six Sigma methodology in product development to eliminate waste and enhance reliability throughout the process.
Immersion tin plating offers a reliable, lead-free final finish for Printed Circuit Boards (PCBs). It ensures excellent solderability, reduces copper-tin diffusion, and helps prevent whisker formation, making it ideal for automotive, fine-pitch, and backplane applications.
Immersion tin plating improves PCB performance by creating a uniform, corrosion-resistant surface that enhances solderability. It prevents oxidation, reduces copper-tin diffusion, and promotes a stable finish, ensuring the longevity and reliability of solder joints after multiple reflows.
While both are used for PCB final finishes, immersion tin excels in lead-free assembly environments, offering superior solderability and corrosion resistance. On the other hand, immersion silver provides exceptional conductivity, making it ideal for high-frequency applications. Each finish delivers unique benefits, depending on the specific application.
Yes, immersion tin plating is highly effective for lead-free soldering. It provides stable, high-quality solder joints even after multiple lead-free reflows, making it an ideal choice for modern, environmentally friendly electronics manufacturing.
Immersion tin plating prevents whisker formation through unique crystal structures and patented pre-dips, such as ORMECON CSN Classic. These processes inhibit copper-tin diffusion, creating a stable, low-stress finish that resists whisker growth even during reflow cycles.
