Drive innovation with our copper adhesion promoters, delivering consistent bonding and precise etching for superior IC substrate performance.
We lead the way in copper adhesion promotion, offering cutting-edge solutions like M-Speed HF and MultiPrep 200. These are designed to meet the demands of advanced IC substrates, delivering excellent adhesion and process stability.
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Enable advanced IC substrates with innovative and robust via filling, RDLs, through-hole filling, and panel-level packaging solutions.
Learn MoreMeet OEM standards with high-performance finishes that enhance solderability and gold wire bonding.
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Produce high-density Integrated Circuit (IC) substrates with our family of semi-additive, high-performance buildup processes.
Learn MoreIntegrated Solutions
Our comprehensive portfolio, from primary metallization to final finishes, supports the fabrication of Integrated Circuit (IC) substrates to meet the challenges of today’s advanced devices.
Sustainability
We lead with pioneering technologies that reduce hazardous materials, and lower water and power consumption, helping you meet your Environment Health & Safety (EH&S) goals.
Reliability
Our specialized processes for IC substrate fabrication enhance the reliability of high-density designs, ensuring lasting performance in demanding applications.
Copper adhesion promotion is crucial for IC substrates, ensuring strong bonds between copper traces and dielectric layers. This prevents delamination and enhances the electrical performance, durability, and longevity of substrates in advanced applications.
M-Speed HF creates an exceptional surface topography on all three exposed sides of the copper trace, ensuring electrical properties meet the demands of high-frequency designs. MultiPrep 200 enhances adhesion to resist layers by optimizing surface topography, leading to superior electrical performance and reliability.
Yes, copper adhesion promoters like MultiBond 500 help minimize whisker formation by improving copper surface topography and enhancing adhesion. This reduces the risk of failures caused by whisker growth, particularly in fine-pitch and lead-free applications.
Our solutions, like M-Speed HF and MultiPrep 200, are optimized for high-reliability applications. We ensure excellent adhesion, surface topography, and minimal diffusion, providing superior performance in demanding IC substrate and microelectronics environments.
Copper adhesion promoters improve process stability by providing consistent adhesion performance throughout production. This reduces defects, increases yields, and enhances the reliability of IC substrates. As a result, we achieve stable and predictable results, even with advanced processes like Modified Semi-Additive Process (mSAP) and Semi-Additive Process (SAP).
