Explore OEMs' preferred choice of OSP solutions, proven in production across diverse lead-free assembly applications.
The industry’s most trusted Organic Solderability Preservative (OSP), ENTEK® Plus HT, ensures superior lead-free soldering through multiple reflows, delivering the highest reliability in Ball Grid Array (BGA) solder joints.
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Achieve Six Sigma assembly performance and exceptional reliability with our ENEPIG corrosion-free, high-uniformity deposits.
Learn MoreExceed IPC quality standards with our ENIG solutions, delivering exceptional performance and the lowest total cost of ownership.
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Secure strong solder joints, touchpad functionality, and aluminum wire bonding with the industry's most trusted ImAg finishes.
Learn MoreGain consistent reliability and unmatched productivity with our trusted immersion tin final finishes.
Learn MoreIntegrated Solutions
Our deep understanding of the interaction between organic solderability preservative molecules and circuit board assembly materials allows us to deliver the most reliable assembly yields.
Sustainability
Elimination of precious metals, low temperature operation and reduced rinse water requirements make ENTEK OSP the number one choice for sustainable surface finishing.
Reliability
Leveraging Six Sigma methodology in product development eliminates waste and enhances the reliability of every solution, ensuring peak performance.
An Organic Solderability Preservative (OSP) is a surface finish used in Printed Circuit Board (PCB) manufacturing that protects copper pads by applying a thin organic layer. This layer prevents oxidation, maintaining solderability for reliable connections in assembly.
ENTEK® OSP creates a consistent, low-resistance surface that withstands multiple lead-free reflows, improving solder joint reliability. Its stable coating minimizes rejects and rework, offering higher yields and consistent assembly performance.
Yes, ENTEK® OSP is designed for lead-free soldering, and maintains solderability and low resistance even after multiple high-temperature reflows. It provides stable, high-quality joints and is ideal for lead-free assembly.
ENTEK® OSP outperforms competitors with superior solderability, even after multiple reflows. Its coating consistency and resistance to corrosion help ensure stable joints and higher assembly yields, reducing rejects and rework.
Yes, ENTEK® OSP is compatible with ENIG (Electroless Nickel Immersion Gold) finishes and other mixed-metal applications. Its selective deposition avoids contamination on gold connectors or heat sinks, ensuring quality results.
