Innovative solutions for robust via filling, RDLs, and through-hole filling in advanced IC substrates, including panel-level packaging.
From trace plating to blind via and through-hole filling, our Systek™ acid copper electroplating technology delivers flexible, reliable results for complex fine-line and through-hole designs, maximizing Integrated Circuit (IC) substrate performance.
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Drive innovation with our copper adhesion promoters, delivering consistent bonding and precision etching for IC substrate excellence.
Learn MoreMeet OEM standards with high-performance finishes that enhance solderability and gold wire bonding.
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Produce high-density Integrated Circuit (IC) substrates with our family of semi-additive, high-performance buildup processes.
Learn MoreIntegrated Solutions
From primary metallization to final finishes, our comprehensive portfolio supports the fabrication of today’s advanced integrated circuit substrates.
Sustainability
Our pioneering technologies use fewer hazardous materials and reduce water and power consumption, helping our customers meet their Environment Health & Safety (EH&S) goals.
Reliability
We offer specialty processes for IC substrate fabrication, enhancing reliability for high-density IC designs and ensuring long-term performance.
Acid copper plating plays an essential role in IC substrate manufacturing by creating conductive pathways, filling vias, and forming Redistribution Layers (RDLs). It delivers a strong, reliable copper layer that enhances both electrical connectivity and structural integrity.
Acid copper electroplating offers preferred grain structure, resulting in exceptional physical properties, superior filling capabilities, and excellent coplanarity. It’s ideal for plating fine lines, blind vias, and through-holes in IC substrates, enhancing performance while ensuring robust, conductive pathways.
Acid copper plating effectively fills vias by depositing copper in a controlled manner, supported by a well-designed additive system. Systek™ solutions, for example, ensure smooth filling of blind microvias and X-vias, minimizing dimples and providing strong structural integrity for stacked vias.
Yes, advanced acid copper plating processes, such as Systek™ MV 400, are specifically designed to prevent common plating issues like voids. These processes ensure smooth and even copper deposition, even at high current densities. By controlling the plating conditions, Systek™ solutions can achieve excellent coplanarity, avoiding voids in vias and effectively plating surface features like traces and pads with consistent, defect-free results.
The Systek™ THF Series efficiently fills through-holes with plated copper, minimizing dimple formation. This process enhances thermal and electrical conductivity while improving stability within core Printed Circuit Board (PCB) layers. Compared to alternatives like paste, it offers superior performance and reduces overall process steps, streamlining manufacturing efficiency.
